Electronics Forum | Thu Jul 10 12:56:46 EDT 2014 | clydestrum
VERY interesting. Thanks, folks. I will look into this.
Electronics Forum | Mon May 18 08:18:53 EDT 2020 | derekjeter
I think it concerns peeling electrostatic potential,and it will get lower throwing rate.
Electronics Forum | Thu Apr 07 15:06:18 EDT 2022 | proceng1
Something like Tacsil tape?
Electronics Forum | Thu Mar 09 12:31:46 EST 2006 | jsloot
I am experiencing peel back problems when a particular component is used on a Meridian 1010 and 1020P machine. I would like to start testing this force but I need some more info. Besides GPD who else makes a tester? What industry standards can I refe
Electronics Forum | Thu Sep 14 08:09:39 EDT 2006 | dmfausti
Thanks for the reply. I will try to clean this feeders. They all seem to be worn out and needs cleaning and adjustments. Peel tester could be another way for us of making sure our system goes more efficiently. This peeling problem usually occurs on
Electronics Forum | Wed Aug 25 11:52:36 EDT 2010 | fdr4prez
We've been breaking the cover tape on components from a specific supplier. I am curious what the standard is for the peel back force range, so I can better know if it is a feeder issue or component supplier. Of course the machine vendor is blaming
Electronics Forum | Wed Aug 25 12:13:40 EDT 2010 | remullis
You may want to search on "Cover Tape", what date code is on the parts reel? I have multiple issues with cover tape sticking to the paper and not peeling back. Causes pick errors due to the part being covered. I think my problem is the parts have too
Electronics Forum | Wed Aug 25 12:44:42 EDT 2010 | fdr4prez
I previously did a search on "peel back force" and there were a few results, and there were a few hits that say EIA-481 is the standard, but nothing on what the standard force range is. A search on "cover tape" yeilds many hits about breaking cover
Electronics Forum | Sun Jun 29 07:31:03 EDT 2014 | vitrost
Hi, We had experienced very similar issue on boards of a certain PCB manufacturer. Field experiments showed that the solder mask of this manufacturer is prone to swelling and peeling after it was in contact with our water-based flux. When you switc
Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F
| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl