Electronics Forum: pizza and reflow (Page 7 of 50)

Lead-free and Leaded solder in the same reflow

Electronics Forum | Tue Jan 31 14:23:39 EST 2006 | samir

Chunks, For our lead-free eval, we had the same problem with "charred looking" solder paste up the component termination of one of the smaller discretes, coupled with excessive solder balling...this smaller part did see peak temps in the 240 range -

Line release of post reflow AOI and AXI

Electronics Forum | Thu Sep 18 15:26:04 EDT 2008 | ismir

Dear Hegemon, I'm very grateful for your help. There is one more thing that I'd like to discuss with you. I'd like to know if there is any "verification board" or something like that to check if you really did a good job. At the company where I wo

Line release of post reflow AOI and AXI

Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon

You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to

Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Thu Sep 07 10:03:30 EDT 2000 | KS Wong

Hello, I am looking for input on the 7 zone convectional reflow oven on the temperature profiling. I having a problem with the flux/solder spattering on the Au cotact fingers. I have ran some experiment with the soak time and reflow time. Anyway,

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB

As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Thu Sep 07 11:02:29 EDT 2000 | Travis Slaughter

Maybe its not splatter, in my experience a sloppy operator can get paste on contacts and just one sphere can rune them and can look like splatter.

Re: Longer soak time and reflow time impact Solder on Au pad?

Electronics Forum | Fri Sep 08 00:24:35 EDT 2000 | Jim Arnold

Sudden flux boil will cause splatter. More thorough drying or a slower intial ramp to allow drying to occur before a boil or "splatter" temperature is reached may aid your problem.

Component Obsolescence and Availability

Electronics Forum | Thu Apr 07 20:42:19 EDT 2022 | stephendo

The boards were just a little larger than a SOT8. IIRC we had a pizza slicer type depanelizer and it wasn't too bad. We just did enough to populate the bare PCBs we had. Where I am now a customer has us put a QFP and a few other parts on a SOW28 f

small and good pick and place machine

Electronics Forum | Thu Sep 05 23:18:03 EDT 2013 | feiyangniao

There is a new toy I received today: a NeoDen TM-240A automatic desktop pick and place machine! I’ve kept my eyes on this baby for a quite a while, and finally decided to make a purchase last week. The shipping was very fast: DHL from China, a total

0201 and uBGA

Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb

On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t


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