Electronics Forum: placement ipc 9850 (Page 7 of 17)

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Mon Aug 27 19:24:00 EDT 2001 | sharafali

It has been mentioned that DPMO offers large advantages over First Pass yield calculations for measuring process performance!!regarding the same I have a few queries: What are the benchmarks for using DPMO as measures of process performance? How is

TOMBSTONE DEFECTS

Electronics Forum | Tue Mar 18 16:41:04 EST 2003 | russ

Here is what I have been finding lately. We switched to a 22mil square pad on 40 mil centers (from the IPC "75/25"). ALL OF OUR TOMBSTONES HAVE GONE AWAY! (at least for now) we did not change profiles, paste, or any other parameter. Obviously placem

Standards &/or Specifications for PBGA Assembly/Inspection

Electronics Forum | Fri Sep 21 11:59:26 EDT 2001 | Carol Stirling

We build IPC Class 3 product and are introducing Plastic Ball Grid Arrays. There is a possibility of out-soucing the build, so I'm interested in the Standards or Specifications the industry is quoting to ensure placement, inspection, reliability etc.

through hole reflow

Electronics Forum | Thu Oct 03 04:04:10 EDT 2002 | Bob Willis

SMTNet has a video tape and interactive CD ROM on Intrusive Reflow Soldering that you may want to check out. In addition there are some free inspection standards for pin in hole printing, placement and soldering available at http://www.dpmo-monitori

Tombstones? Pb vs Pb Free

Electronics Forum | Tue May 09 17:56:36 EDT 2006 | russ

When we first started we had this problem, we eliminated by longer profile (less delta T) and then ultimately chnaged pad dimensioning for 0402 away from IPC standard. i would highly recommend that you check your placement accuracy and your prof

How much capacitor offset is acceptable?

Electronics Forum | Mon Dec 18 08:52:57 EST 2006 | russ

You need to get yourself a copy of IPC 610. this has all the specs regrding placement and registration. chip aprts are allowed to have 50% side overhang. the fillet requirements are "evidence of wetted fillet" . I would not know if a cap being 51

Qualifying a new SMT automated assembly line

Electronics Forum | Thu Oct 16 14:12:36 EDT 2008 | evtimov

Hi, I think the standard was IPC 6850. But I will recommend to go directly with the sigma test. Place parts with the machine and measure the placement accuracy on another machine. 4-5sigma at 50um should be a good machine. If they have sigma in thei

Fifo of solder paste

Electronics Forum | Sun May 05 17:27:32 EDT 2013 | davef

Here’s a Tweet that I made here [http://blogs.smtnet.com/smt/smt-placement/ipc-apex-2013-my-tweets/ ] … Hisco’s computer controlled frig for managing solder paste inventory … way more sophisticated than that old white frig. Davef I receive no benefi

Scored Panel Depth

Electronics Forum | Mon May 21 17:37:51 EDT 2001 | davef

IPC-2222, Sectional Design Standard For Printed Board For Organic Printed Boards talks to scoring parameters in para. 5.3.1. You can obtain the standard at: http:///www.ipc.org. and Document Center [http://www.document-center.com/home.cfm/sid=71285

Re: bowtwist

Electronics Forum | Wed Jul 21 13:12:11 EDT 1999 | John Thorup

| I have pcb's in which i am experiencing warping. | the boards are 12.8125" on a diagonal measurement. | they are out approximatley .010". | the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,and what is the pr


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