Full Site - : point to point solder damage (Page 7 of 83)

How to inspect the temperature recovering time of thermal shock chamber?

Technical Library | 2019-11-12 02:09:22.0

Thermal shock test chamber can be used for testing the chemical change or physical damage on composite materials caused by the thermal expansion and contraction of the sample in the shortest time,which is subjected to extremely and continuous high and low temperature environment.so how to check the temperature recovery time of this chamber? Normally we take following steps to inspect the temepratuire recovering time: 1.Install the temperature sensor at the specified position, and adjust the temperature controller of hot zone and cold zone to the required nominal temperature respectively. 2.The temperature increases and reduces respectively,30min after temperature in two zones reach stable status,record temperature value of the measuring point,pls set the temperature value of two zones to be required nominal temperature. 3.The temperature shock test chamber automatically places the inspected load into theh ot zone,select the corresponding retention time according to regulated standard. 4.Set the transfer time,then the inspection load is transferred from hot zone to cold zone, and the temperature of the measuring point is observed and recorded, and then the reverse conversion of the load from cold zone to hot zone is carried out according to the same method, and the temperature of the measuring point is observed and recorded. www.climatechambers.com

Symor Instrument Equipment Co.,Ltd

Oxide Thickness and Solderability Methodology to Determine Long Term Storage of BGAs and QFPs

Technical Library | 2014-10-16 16:39:12.0

Key points are: *Long-term storage of BGA & QFP products may be required due to: Fab and assembly factory transfers Product obsolescence requiring customers make lifetime/EOL purchases Providing extended service (10+ years) on vehicles Other program needs * Integrity of EOL products in terms of solderability needs to be verified.

Freescale Semiconductor Inc

How to Prevent Short Circuits to Ground in QFN Components?

Industry News | 2018-10-18 08:29:16.0

How to Prevent Short Circuits to Ground in QFN Components?

Flason Electronic Co.,limited

Nihon Superior to Introduce TempSave duringAPEX 2021

Industry News | 2021-02-12 16:08:40.0

Nihon Superior Co. Ltd is pleased to announce thatit will exhibit its newly developed TempSave series during the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The company also will showcase its NozzleSave alloyalong with SN100CV P608 and LF-C2 P608 solder pastes.

Seika Machinery, Inc.

How to attach a thermocouple to a target PCB?

Industry News | 2018-10-18 10:17:48.0

How to attach a thermocouple to a target PCB?

Flason Electronic Co.,limited

How to Replace Refrigerator Compressor

Industry News | 2021-12-28 20:35:34.0

If the refrigerator compressor is broken and can no longer be repaired, you need to buy a new one to replace it. When replacing, you need to follow the correct steps. Then how to change the refrigerator compressor? The following are the detailed steps.

OKmarts Industrial Parts Mall

Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX

Industry News | 2022-01-03 07:24:21.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit TipSave N at APEX 2020

Industry News | 2020-01-06 16:02:00.0

Nihon Superior Co. Ltd. is pleased to announce plans to showcase its new TipSave N flux-cored solder wire in Booth #2043 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The company also will exhibit SN100CV P608 D5 solder paste.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX

Industry News | 2022-12-21 10:42:04.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.

Nihon Superior Co., Ltd.

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Industry News | 2018-10-18 08:21:10.0

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Flason Electronic Co.,limited


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