Electronics Forum | Thu Jul 09 15:09:02 EDT 1998 | ZULFIQAR
Dear Russ, What is the information source for this type of stencils? Did you get any info about the manufacturers and also any feed back from users? How widely it is used will give us a data w.r.t. its validity.Will you be kind enough to send the
Electronics Forum | Tue Jan 21 10:55:26 EST 2003 | MA/NY DDave
Hi From what you write no one here should have an answer since too little data is supplied. You might need to go to an FEA modelling shop to model the stresses and observe fatique life, or find a group to discuss your process and your application p
Electronics Forum | Sat Feb 01 15:25:42 EST 2003 | MA/NY DDave
Hi Again I would rather you have someone analyze this rather than using another person's data from potentially a completely different type of application. The fact that he said the reliability was the same as rigid kind of bothers me. Usually on fl
Electronics Forum | Wed Jan 05 17:53:52 EST 2005 | SuePH
We had a contract in house that included a flex board which required an 18 hour bake at 105 degrees. The other brds got along fine with 2 hours, but the flex board would delaminate until we went to this long bake. I don't know how the engineer came
Electronics Forum | Mon Mar 25 16:40:17 EDT 2013 | rrpowers
I have a customer that is wanting to use a low-temp solder paste such as SnBi for a lead free circuit, however they are specifying PET for the flex circuit. I have always used polyimide for SMT reflow due to the temperature limitations of polyester.
Electronics Forum | Wed Oct 30 15:50:22 EDT 2013 | joeherz
Vince, We see the same disks on some parts incoming. SMT PEM nuts in tape and reel are very common. We get the parts from PENN Engineering. One of them is SMTSO-M3-4ET. PENN Engineering may be able to steer you in the right direction on who their
Electronics Forum | Mon Nov 26 13:40:40 EST 2018 | robl
Hi Prem, Yes, the flux in the Cobar paste helped with wetting and joint strength, as does reducing voids as there is more solder in the joint, as does cooling rate. Regarding peel test in KG, it depends on the pad size and volume of solder in the j
Electronics Forum | Thu Apr 22 17:39:26 EDT 1999 | Earl Moon
| To all who will be potentially my salvation, | | I am currently researching Polyimide stencils for possible use and manufacture. If I may be indulged - with due reference to all past enquiries and notes on the subject - can anyone offer an up to d
Electronics Forum | Tue Oct 20 10:57:18 EDT 1998 | Craig Ramsey
Dear Bob, The Tessera microBGA technology defines a family of CSP devices. The most common microBGA type is the TV46 that has been selected by Intel for use with their flash memory devices. A microBGA package in general consists of the silicon die
Electronics Forum | Mon Feb 15 15:33:47 EST 1999 | Earl Moon
| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc | I'm sure you know all the basic differences as Tg, X, Y, and Z expansi
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