Electronics Forum: prepares (Page 7 of 37)

Line release of post reflow AOI and AXI

Electronics Forum | Thu Sep 18 15:26:04 EDT 2008 | ismir

Dear Hegemon, I'm very grateful for your help. There is one more thing that I'd like to discuss with you. I'd like to know if there is any "verification board" or something like that to check if you really did a good job. At the company where I wo

Pick and Place vs CAD File

Electronics Forum | Wed Oct 18 09:32:05 EDT 2017 | alexeis

Hi, Pick and Place file is included in CAD file. CAD file contains full information about a board including internal layers, silk, PAD/Component structure, and more. You can use Pick and Place (PnP) file on preparing SMT Programs. In case of small

IQ, PQ, OQ report question.

Electronics Forum | Tue Apr 09 17:33:45 EDT 2019 | tey422

I just assigned to make an IQ/PQ/OQ validation report to prepare for a couple of new yet very simple medical assemblies we are to build for. I have no idea how to make this report. All I know is I have to come with the validation report for all the

CAM350 Pocket Routing

Electronics Forum | Tue Aug 22 01:44:19 EDT 2023 | tracyberge

CAM350 is a software primarily used for PCB (Printed Circuit Board) fabrication and assembly processes. While CAM350 provides various features for PCB design and manufacturing, it does not directly support pocket routing or internal routing within sh

Slow day at the 'net

Electronics Forum | Tue Dec 19 19:11:37 EST 2000 | Michael Parker

Not much activity here in the past few days. Just wondering if you all have been egg nogging it too much in preparation for jolly ol' St. Nick. Or could it be that some have taken to smoking the mistletoe? I hope DaveF. has recovered OK from his re

Re: Wave solder of TQFPs

Electronics Forum | Fri Jul 21 11:30:39 EDT 2000 | Joe H.

Craig, Since you didn't share any detail regarding the component side of the board or what other components reside on the bottom side, I'm prepared to take a stab in the dark. Have you considered doing a double sided reflow on this board? Also

Where's The Beef?

Electronics Forum | Fri May 11 15:25:58 EDT 2001 | davef

I'd imagine the benefits of AOI come through: * Reducing labor * Increasing yields * Lowering test costs * Increasing volumes * Improving quality * Possibly reducing the cost of collecting data What would you suggest as other areas of benefit? What

Re: BGA vs. QFP Packaging.

Electronics Forum | Tue Nov 09 13:57:08 EST 1999 | Dave F

Gary: Three things to look at in preparing do your lab work: 1 Delco uses boat-loads of array devices, use your contacts there for information. 2 SMTA Journal publishes much relaibility study information. 3 "Solder Joint Reliability of Bga, Csp, Fl

SMTnet brochure now available for download

Electronics Forum | Thu Oct 22 16:36:04 EDT 1998 | Michael Bryant @ SMTnet

The new SMTnet brochure is now available for download in Adobe Acrobat .PDF format. It's around 2 MB so be prepared if you have a dial-up connection. We will be adding links to a desription page with the download location tomorrow on various parts of

Re: Holetites

Electronics Forum | Mon Sep 21 09:03:08 EDT 1998 | Greg Curler

| Good Morning, | I am looking for an alternatve to the traditional press in low profile sockets, aka Augat Holetites. I am looking into Mill-Max parts. any suggestions? They are used on the backplanes we build. | Thanks, | Wendy Wendy, We are pr


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