Electronics Forum | Thu Oct 26 17:42:29 EDT 2000 | Philip A. Reyes
Hi Mr Paul! Thanks for answering my previous questions. Hope you can still accommodate my other queries. This is about the acceptable criteria of PBGA defects after reflow soldering. 1.What is the allowable (min and max. ball misregistration / misal
Electronics Forum | Sat May 18 10:21:09 EDT 2013 | davef
isd.jww: Comments are: * Current thinking has flux volatiles being the major contributor to voiding, not scavanging by via * I have no reason to think that 0.3mm via won't gladly accept solder. Plug them, if that's a concern. * If your concern is ina
Electronics Forum | Mon Sep 28 07:20:49 EDT 1998 | Earl Moon
Does anyone out there have any pictures (jpeg preferred) of solder paste prints - or know where some are available. It will be awhile before our 35mm camera for our 3D scope arrives and I need some for inspection criteria. I need the good, bad, and u
Electronics Forum | Mon Sep 26 20:10:58 EDT 2005 | Anna
What type of alloy and at what temperature do you use for wave soldering? Do you need to modify your machine? I am using SCN but I have problem controlling my bath. Are you running on multilayer board or PTH boards? Do you face any fillet lifting
Electronics Forum | Fri Sep 24 20:02:39 EDT 2004 | pabloquintana
OK, We have tested and changed several things in our process, but we still getting the same result. We are trying another type of coating. We will see later. My question now is what is adhesion wise acceptable in the industry. I know many of you wi
Electronics Forum | Thu Nov 04 15:06:33 EST 2004 | dramos1
Hi Russ, Thanks for the input. We already check our subcontractor mounting of the connector on the board and it seems that the problem is related to some batch of connectors from their vendor. Anyway, i believe that your suggestions on the agreement
Electronics Forum | Thu Oct 27 09:57:38 EDT 2005 | Rob.
http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=8138&#Message32185 Remember, put it as part of the purchase order, then if it doesn't perform you have a legal base from where to start holding back payment unitl issue
Electronics Forum | Wed Jul 12 08:57:58 EDT 2006 | Evamaria
Mike , Look at http://www.circuittechctr.com, Guidebook, section 6,6.1. This method of attaching jumper wires is in accordance to the acceptability criteria of IPC-A-610 section 11.2.4.3. You did not specify what wire AWG is. I am assuming it is sma
Electronics Forum | Thu Apr 12 01:35:13 EDT 2007 | Haris
IPC-A-610D is a Acceptability of the Electronic assemblies so all your questions depends on the product classes either 1,2,or 3 and it is given in this standard about the acceptablity criteria of the soldering of any type of the components i.e. it h
Electronics Forum | Wed Apr 11 20:49:39 EDT 2007 | raychamp007
3W. Figure 8-84 shown evidence of heel bend wetting(but no written criteria mention about the solder fillet must present at the heel bend). It is acceptable if the minimum D(3W/75%L)extend from toe which is no evidence of solder fillet at heel bend?
