Electronics Forum | Tue Apr 09 08:44:43 EDT 2002 | davef
Read IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)". There is no advantage in dropping off much faster than 4�C/sec. In fact, you risk fracturing your newly formed solder connections due to board warping
Electronics Forum | Tue Jun 04 16:12:41 EDT 2002 | Bob
The original profile had a higher ramp rate, and the apertures were 100%. The ramp rate is now much gentler and the addition of a small soak area around 160 � 170 degrees should burn off any excess flux. Appertures are now smaller and we get no leac
Electronics Forum | Wed Apr 21 17:27:27 EDT 2004 | russ
We always use the regular production reflow profile when we use this method. Since you don't want to do that, All that is required is to ramp the part up to temp to get the balls to melt. If you don't exceed 2C per sec. in a ramp you will be fine.
Electronics Forum | Fri Dec 16 11:04:23 EST 2005 | chunks
Over all time will be dictated by your conveyor speed. Your conveyor speed will be dictated by your products time above liquidous. Time above liquidous is dictated by the manufacturers specification. Time and temp before reflow will have to be ach
Electronics Forum | Mon Feb 13 13:19:35 EST 2006 | pjc
ECD's OvenRIDER is the only instrument I know that can measure thermal transfer efficiency of a an oven. I suppose it would work for environmental chambers too. This instrument has thermocouples to measure ambient temp of oven zones and well as hi-ma
Electronics Forum | Fri Jul 28 09:40:11 EDT 2006 | pavel_murtishev
Good afternoon, 1. Yes, most of all I suspect the components. Could you explain what does mean "reflothermal recipe"? Ramp-to-spike? Ramp-soak-spike? Something special? Thanks. 2. Void is really huge. This voiding differs from "standard" voiding ef
Electronics Forum | Wed Jan 10 17:08:12 EST 2007 | mscalzo3
Brian, There are a couple of ideas that you can use for this. Slowing the ramp is the first one that comes to mind. I would try soaking at about 10 degrees "C" below the solidus of the alloy for about 45-60 seconds. Slowing the ramp to remove the
Electronics Forum | Fri Dec 21 10:12:46 EST 2007 | ck_the_flip
Operator, Think "opposite". You actually want to MINIMIZE the ramp-up rate. Think about 2 - 3�C per second as your upper limit for ramp up. You don't want to go more than 4�C per second for thermal shock reasons. All of this, of course, depends
Electronics Forum | Fri Oct 09 02:54:57 EDT 2009 | omid_juve
Dear sir`s i want to place one TBGA144 with DRS24 rework station i use many different profile but with near all of them in the ramp stage and reflow stage the balls of the BGA thrown away from the part and cause many short circuit under it and also m
Electronics Forum | Mon Nov 16 10:50:50 EST 2009 | ppcbs
I agree customer is being overly stringent, and that their is a possibility that BGA's have voids prior to installation. If you determine that the BGA's do not have voids prior to installation I suggest you slow down your ramp speed to allow the flu
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