Electronics Forum | Thu Dec 01 12:23:35 EST 2005 | faortiz
Hi, I'm wondering if anybody knows of another vender other then Winslow that makes disposable BGA reball templates? I really appreciate your help. Thank you, Felipe
Electronics Forum | Fri Mar 03 06:52:55 EST 2006 | bwet
There are several companies including the one I work for that provide reballing services. Cost depends on the part. All of the companies will want to know mechanical data, alloy and package type. Expect to pay in the
Electronics Forum | Tue Jun 13 16:33:26 EDT 2006 | markk
Anybody doing their own BGA Reballing? I'm looking for a good kit that can handle both leaded and lead-free. Any suggestions?
Electronics Forum | Wed Feb 21 10:39:06 EST 2007 | russ
Contact practical components, they have masks and balls, I would not call it automated though. These are simply placing the mask over the part and dumping the balls on it then removing (brushing)the excess balls. I have run and reballed BGAs with ou
Electronics Forum | Mon Nov 05 18:31:34 EST 2007 | bandjwet
What methods are being used in industry successfully to reball smaller pitched devices (0.5mm pitch, 12 mil balls and below)? Regards BWET
Electronics Forum | Wed Aug 25 09:55:16 EDT 2010 | mikesewell
Have the huge LF BGA reballed to leaded and assemble it with your leaded process. Time savings from using the rework station should pay for the reball if you're doing more than just a few.
Electronics Forum | Fri Mar 22 12:57:30 EDT 2013 | bandjwet
Does anyone have any "tricks" for getting all of those little pieces of paper removed from the pad/ball side of a BGA after reballing. We are using the paper preforms and there are lots of those little preform remnants everywhere!
Electronics Forum | Thu Oct 26 14:00:18 EDT 2017 | sambolian
Is there a threshold on ball size where we would not need to re-ball a BGA ( i.e. 8 ball / small type packages).
Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
