Electronics Forum: reflow pallet (Page 7 of 20)

Flex circuits

Electronics Forum | Sat Jul 03 10:03:22 EDT 2004 | Bryan Sherh

Things to consider are: * Thermal expansion > characteristics of you flex and your pallet > should be better matched. We use G-10. * > Placement of your two sided tape should be > better, more uniformly distributed. We run strips > the length o

Re: PCMCIA QFP Process Issue

Electronics Forum | Wed May 24 16:47:22 EDT 2000 | Chris McDonald

I have found that if you have a custom carrier with support between pcbs on both SMT reflows (If you palletize) it will eliminate warping. Also Prebaking PCBS with wieght on the top of them helps too. Also look at the cooldown of your oven profile, y

Pallet absorb thermal heat : compensate by higher deg-C?

Electronics Forum | Sun Jun 10 12:30:10 EDT 2001 | procon

Is this a Convection Oven or IR? If convection, you can increase the air velocity in the zones if the oven has this ability. You should do as Dave has explained. If you must use pallets when reflowing your components, you need to profile in the same

Assemby of flexible printed circuits

Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef

Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies

BOTTOM SIDE CHIP COMP FALLEN OFF IN WAVE SOLDER

Electronics Forum | Sat Dec 05 09:17:24 EST 2009 | nagesh

Solder paste & reflow the Bottom side.Use wave solder pallet to isolate the soldered components.

Silver Emerge

Electronics Forum | Mon Jun 18 21:21:25 EDT 2001 | davef

Two things: 1 A flat surface will probably help the "balls on the socket sliding off the ridge of HASL" problem, but possibly consider less risky choices for your flat surfaces that immersion silver, like: OSP, ENIG, and immersion tin. 2 Don�t throw-

2-sided BGA

Electronics Forum | Tue Jan 30 21:13:26 EST 2001 | davef

Two options: 1 Glue 2 Use a dedicated work holder with 'pockets' milled out to accommodate the components on the first side of the board after reflow. Some prefer a pallet that runs all the way through their process. So, these pallets: * Feature

Re: Fine Pitch 48-pin TSOP

Electronics Forum | Fri Dec 01 01:42:09 EST 2000 | PeteC

I recommend paste print-reflow the bottom side then use a selective wave solder pallet to mask the SMT components on the bottom side. PeteC

SMT Carrier Pallets

Electronics Forum | Tue Feb 09 12:30:37 EST 2021 | jzeivel

I am quoting a new job and am wondering if I should use carrier pallets for it. There are 2 PCBAs both are 31mil thick. One is about 16 inches long, and the other about 13 inches long. Both are 1.4 inches wide. I was thinking to put them in a 2 u

Comparison between Glue & solderpaste process

Electronics Forum | Fri Jun 21 16:41:10 EDT 2002 | pjc

If your wave machine has the new style Rotary Chip Wave and the Hot Air De-Bridging Knife options you can expect good yields. However, depending on the PCB design, double-sided solderpaste reflow and selective solder pallets for wave solder is a bett


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