Electronics Forum: removal (Page 7 of 310)

no-clean flux removal

Electronics Forum | Thu Jan 20 08:37:11 EST 2005 | patrickbruneel

I agree with dave here's an example of a previous thread on the subject. http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=6947&#Top

no-clean flux removal

Electronics Forum | Thu Jan 20 10:12:08 EST 2005 | patrickbruneel

Mike, I totally understand your position. We find ourselves in two opposite camps. If no-residue was impossible my company would not be in business today. Lets focus on the topics so we can help people with their problems. Patrick

Re: BGA removal

Electronics Forum | Fri Mar 27 02:05:26 EST 1998 | Jon Gruett

AS the previous have stated there are several ways to get the BGA's off the board. Let me first ask you a couple of ?'s. 1)Are you concerned at all with the damage to the baord or the BGA? 2)Are you eventually going to need to consider the reattac

BGA void removal

Electronics Forum | Wed Oct 09 19:08:37 EDT 2002 | russ

AJ, I have bought and used 2 DRS24's in the past. It is a good machine. (I don't think that I will bring up the fact that a certain package that I had kept shorting so I sent them a couple to help with the profile and all of them came back shorted

Selective BGA ball removal

Electronics Forum | Thu Oct 30 00:12:13 EST 2003 | Grant Petty

Hi, Another option we have used here in house is to remove the unwanted BGA balls with solder wick, and then to manually place them on the PCB foot print. This eliminates the pick and place machine's optical centering freaking out because the balls

BGA void removal

Electronics Forum | Mon Oct 07 09:05:41 EDT 2002 | russ

thnaks everyone for the the input. I have been noticing that a lot of comments are referring to 230 deg. C and such. has something changed in the industry lately? It has been to my knowledge previously to peak the reflow at 215 or so. I have many B

no-clean flux removal

Electronics Forum | Fri Jan 21 13:57:52 EST 2005 | saragorcos

Hi esoderberg - I was wondering if you had tried altering your soldering profile to try and fully solublize the no clean flux residues and elimate your cleaning dilemma? You can check out my company's website if you want some free reference material

LCS removal from Topaz/Emarald

Electronics Forum | Sat Sep 05 16:09:10 EDT 2015 | emanuel

Need assistance - I want to disconnect an unused LCS module from an Emerald machine. I disabled the tray changer and buffer conveyor in the machine's configuration but I still get an L212 error on the bottom of the screen and the machine hangs during

BGA void removal

Electronics Forum | Mon Sep 30 20:41:25 EDT 2002 | jason

Hi, The acceptance level for voids is 25% and most of it on your case should be the paste. If you want to reduce / eliminate it, you gotta have the Production to practise FIFO for the usage of the paste. If it is expired paste or exposed to long

BGA void removal

Electronics Forum | Wed Oct 09 16:59:35 EDT 2002 | davef

Russ, as I told Eric the other day ... The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This prov


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