Electronics Forum: removing oxidation (Page 7 of 18)

Re: Fiducial Capture MV2F & CP4-3

Electronics Forum | Sat Aug 22 10:25:11 EDT 1998 | Ben Salisbury

| We are using PCBs of CEM3 Material with bare copper fiducials. The whole | board is of bare copper with a lacquer coating (Coats brother S2974). | The fiducials are of 1 mm diameter bare copper. we use Panasert MV2F as | well as Fuji CP4-3. In bo

Re: Ok Earl I give already!

Electronics Forum | Tue May 19 05:42:36 EDT 1998 | Earl Moon

| Earl, | I admit that I missed your article since I seemed to have let my subscription to Circuit Fabrication Magazine expire. I am interested in your experience in this area. Is there a way to get a copy of your paper? Could you maybe post it to

Re: BGA problem: open after reflow

Electronics Forum | Mon Nov 06 09:38:55 EST 2000 | Dean Stadem

We have seen this problem several times. It always goes back to pad solderability, very seldom does it have anything to do with ball size. If there is no evidence of wetting on that pad, but all of the other pads did solder, you need to ask yourself

BGA ball and PCB pad

Electronics Forum | Fri Feb 20 13:01:26 EST 2004 | Jay

First, it depends on the alloy composition of the solder. As you might know, eutectic Sn/Pb solder has the lowest melting point among available conventional solder systems. (except those based on Sn-In and Sn-Bi systems.) For example, 63Sn/37Pb - 183

exessive yellow-gold coloring in the solder pot with tin-silver-copper alloy

Electronics Forum | Mon Sep 25 15:32:21 EDT 2023 | joeljacobo

hello colleagues, Hoping that everyone is doing well, I am reaching out to you in the hope that your experience can help me. We have a wave solder with sac0307 alloy and the pot has turned a golden color, at first I thought it was common tin oxidat

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F

Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,

Re: Dross/Oxide problems with wave soldering machine

Electronics Forum | Mon Jan 31 12:24:24 EST 2000 | Dave F

Robert: Several points: 1 Dross is a mixture of various things with no "fixed" composition: � The obvious things are metal oxides mixed with metal and this can vary in color with temperature and composition - remember some intermetallic oxides form

Black pad on BGA after removal

Electronics Forum | Thu May 05 09:17:58 EDT 2005 | jimmiem

I tried soldering to several of the black pads and was successful, the solder stuck with no hesitation. so i guess this is not truly "black pad"? would that be a correct statement? What causes this blackening that looks like oxidation under the mic

FR4 boards Delamination Cause?

Electronics Forum | Fri May 23 23:47:46 EDT 2008 | dint46

Wayne; Several things. 1.check the vendors and see what black oxide they are using are they the same ? It might be that. 2.You should bake your pcbs before the thermal stress is applied. To remove moisture. At your shop. The proce

Vacuum Bags

Electronics Forum | Wed May 16 16:34:09 EDT 2007 | aj

"Usually people use the vacuum to remove air and then replace with nitrogen to eliminate oxidation and a medium for bacterial growth. Why anyone would need to vacuum pack a pcb is beyond me, though. " We might get a batch of 400 pcbs in but the kit


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