Electronics Forum | Mon Jun 19 04:42:37 EDT 2006 | Loco
There are plenty of studies on this subject. If the BGA can handle the extra temperature and they are soldered on a leadfree profile, the general result seems to be a better reliability than Pb :) Just out of the top of my head, there was a link to
Electronics Forum | Thu Oct 31 12:33:14 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Tue Feb 01 10:11:36 EST 2011 | clampron
good Morning, it looks from the peak temperature that this is a RoHS application? If so, is the BGA that you are having issues with leaded? If so, you might be experiencing "ball drop" where the ball becomes disconnected from the component substrate
Electronics Forum | Fri Nov 13 06:56:37 EST 2009 | CL
Good Morning, The customer is looking for void free connections. They had never specified an acceptable percentage. We are reacting to the test yield. Our yield has averaged 50%. We do not test the product so we rely on feeback from the customer. Us
Electronics Forum | Tue Jun 20 14:54:02 EDT 2006 | grantp
Hi, That's a really interesting article, however one thing I am a little confused on. They seem to say a Pb-Pb solder joint is almost as bad as a Pb-lead free joint in their results. Are they saying the testing which looks like it cycles up to 125 D
Electronics Forum | Thu Jun 22 12:03:58 EDT 2006 | Chunks
Oh yeah, I forgot about the great big burn of 2006 you and davef laid on me. Wow, good one fellas. Now high five each other. Don't forget the butt slap. Now belly slam! (wow 578 lbs of flab just met in a cube somewhere!) Rub each others bald spo
Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr
Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-
Electronics Forum | Thu Jun 22 13:53:43 EDT 2006 | grantp
Hi, Yes, I agree, and it seems like these studies were designed to show that lead free soldering was better than lead based soldering, and they threw in some results of lead components soldered in a lead free process, which seemed about the same rel
Electronics Forum | Tue Jun 20 11:31:15 EDT 2006 | muse95
This has been debated several times on this forum, but I have to say the opposite of Samir. I would rather see a SnPb BGA in a Pbfree process(as long as the component can take the heat) than a Pbfree BGA in a SnPb process. There has been some mention
Electronics Forum | Wed Jun 21 13:25:16 EDT 2006 | muse95
I see what you're saying - I'm not a process guru by any means. I was going on the premise that SAC melts at a higher temperature than SnPb. Basically I think of it as a BGA is joining solder to solder, unlike an SOIC where it is tinned metal lead t
