Electronics Forum: serial and number (Page 7 of 28)

tape splicing pros and cons

Electronics Forum | Thu Sep 22 13:09:16 EDT 2005 | gregp

Thanks for the reply Rob, This we already do. The machine will pick from the most efficient available feeder (assuming multiples of the same part number)...so when you remove the primary it will seemlessly move to the next available. When you re-in

ICT and specifying PCBA testing

Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway

I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 22 17:48:48 EDT 2015 | aemery

It's your first line, go with established manufacturers. Whether new or used it ultimately comes down to does the tool do the job and how well is it supported (labor/parts) if it does break down. I am a former field eng. with Speedline and now run

Panasonic MV2C pick and place.

Electronics Forum | Wed May 13 00:52:36 EDT 2020 | gabriel1blue

I need help. I have a old panasert MV2C pick and place machine that was working great until we had to shut down due to the Covid-19 pandemic, and now everything is off. We had the system data saved but even after we restored everything from Japanese

repeatabilty and measurement for quality

Electronics Forum | Mon Sep 10 17:52:30 EDT 2001 | mparker

Are you doing actual measurements of the dummy parts placements? or are you just doing a visual go/no go check? If doing actual measurements, be sure to use mil inch units of measure rather than mm. Mil will give you more accurate readings. mm force

BGA ball and PCB pad

Electronics Forum | Tue Feb 17 04:52:13 EST 2004 | John W

There's normally a number of reasons people want to know what melts 1st, 1 - to see if you know, 2 voiding issues - whole can of worms 3 device alignment. One of our collegues has said that most balls are Eutectic, that's in fact not totally correct.

Heat guns and component damage

Electronics Forum | Wed Feb 01 08:12:04 EST 2006 | Chunks

OK, this is easy. You say HIGH fall out, so I can assume 25 or 50%? If so, run 10 without the heat gun and 10 with. This should show you if the heat gun process is the cause or not. If the relay is a surface mount, hand solder them on. If it's a

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind

SPI and AOI Machine Feaures.

Electronics Forum | Wed Feb 10 05:23:17 EST 2021 | karl_willoughby

Hello. I am sourcing machines for an SMT line (for the first time) and would like to understand features of current and earlier model SPI and AOI machines. In the intended application, a high volume of PCAs aren't required to be processed but there

PC-based Oscilloscopes and KS0718 C Library

Electronics Forum | Wed Jun 11 08:02:58 EDT 2008 | electronicsrobotics

Can anyone help about Multiport Serial Adapters, 8051 development tools, watchdog timer, Embedded C Compilers,8051 Free Info and Code, Multi Function Timers, World Class 8051 Trainers, PC-based Oscilloscopes and KS0718 C Library? I have gone throug


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