Electronics Forum | Sat Oct 02 20:19:19 EDT 1999 | John Dwinell
| | I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Ir
Electronics Forum | Tue Mar 13 08:04:28 EDT 2007 | Cmiller
We have used thousands of them with no problems. They will not aid in "connector retention" unless you have a shear force at exactly the right angle. This is an advertising joke. They will help with alignment of the connector. Open your holes up so t
Electronics Forum | Tue Nov 09 20:06:26 EST 1999 | Robert Culpepper
This may help you regarding the V-Groove or scored board designs. With respect to material left, I did some experiments and found that for our process .009 of material seemed to be ideal. There was minimal stress required to break the boards apart ye
Electronics Forum | Tue Nov 06 18:39:08 EST 2001 | MikeF
Also, check the website for Assembly magazine, http://www.assemblymag.com, they have some good information on the basics of torque. Determining the "correct" torque value can become very complicated very quickly. The same size screws made from differ
Electronics Forum | Thu Dec 03 13:24:12 EST 1998 | Russ M
| | | Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | |
Electronics Forum | Fri Jan 15 09:27:18 EST 1999 | Earl Moon
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Fri Dec 04 13:25:34 EST 1998 | Jeff Sanchez
| | | | Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. |
Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef
1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
