Electronics Forum: sheets (Page 7 of 72)

Ferrite inductor corrosion

Electronics Forum | Mon May 18 15:30:07 EDT 2020 | dwl

I've seen that before, had to switch to a no clean process for those boards. It's not typical for ferrites, usually its safe to wash them. Out of curiosity does the Data sheet say anything about whether or not they can be washed? In my case we lear

Looking for "carrier" for Reflow

Electronics Forum | Tue Oct 03 17:08:31 EDT 2023 | assuredtech

What Is FR4 Substrate Material? FR4, also written as FR-4, is both a name and a standard rating. The name is applied to the fiberglass-reinforced epoxy-laminated sheets used in printed circuit board manufacturing. However, the name also functions as

Stencil-PCB Alignment Mehods - Printing process

Electronics Forum | Fri Dec 09 15:10:55 EST 2011 | davef

Can you use the equipment manual as the basis for learning how to use the machine? Each model of printer has different alignment techniques. We don't have a clue of your model type. So, we'll approach the question from its most basic point. Registe

Re: Laminate base material

Electronics Forum | Mon Mar 27 20:52:22 EST 2000 | Dave F

Marc: In printed circuit board fabrication, fabricators place sheets of prepreg between each pair of glass cores. They stack these layers into books. As they heat and press the books, the sheet melts into an epoxy glue. The thickness of the prepr

Re: Soldering to Paladium vs. Tin_Lead plated comps

Electronics Forum | Mon Feb 23 10:39:37 EST 1998 | Igmar

| I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would appre

Reflow Carriers

Electronics Forum | Tue Aug 29 07:40:20 EDT 2006 | CL

Good Morning SWAG, We have the same situation. We have found that for the most part, bottomside components do not move from thier location durring reflow unless pressure is applied. We have had instances where the component is able to drop down into

Copper Finishes versus Layer Thickness

Electronics Forum | Thu Jan 04 12:51:37 EST 2007 | Board House

Hi Chunks, Starting copper on outer layer with .0007 is 1/2 oz. copper foil. so if starting copper is .0007 and your Board house will plate an additional .0021 mils of copper. which will give you a finished copper weight of .0028 Mils or (2 oz.) Y

FR4 or CEM3

Electronics Forum | Fri Jun 04 01:13:31 EDT 2010 | boardhouse

Hi fotis, Big difference between Cem3 & FR4 is that FR4 the glass is woven and Cem3 is sheet glass non-woven. for Multi layer product, i would not consider Cem3 due to increase chance of de-lam due to lack of weave for strength. Cem1 and Cem3 are

Looking for "carrier" for Reflow

Electronics Forum | Mon Oct 02 11:52:22 EDT 2023 | proceng1

We have these thin and flexible sheets of fiberglass that we sometimes use to send boards through reflow that can't ride the edge hold fingers. We've had these sheets for a decade at least and have no idea what they are or where they were purchased

Non-Waveable SMT Caps

Electronics Forum | Thu Jun 21 22:42:45 EDT 2001 | davef

We're doing one of those review things for some reason that none of us can remember. We just printed-out the product sheets on a whole pantload of SMT capacitors [rather than use the old moldy ones we have in some file cabinet ... BIG mistake] that


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