Electronics Forum | Fri Dec 18 09:07:24 EST 2009 | tommyg_fla
dave, where I work they are having the same problems with 1B31 acrylic. The coating thickness is 6-8 mils dried so that have to do several passes with an air dry between them and a final oven cure. They think that it might be related to the heating r
Electronics Forum | Thu Nov 19 05:18:37 EST 2009 | prodivegsr
Hi All, Recently we are working on the conformal coating process using Humiseal chemical 1B73 and thinner 521. Bubbles on component body/joints are seen after gone through the IR Reflow Oven. During the conformal coating, only tiny bubbles seen af
Electronics Forum | Fri Dec 18 09:27:51 EST 2009 | sforman1
Tom: Once again - why are you using solvent based conformal coating. 1B31 is OK as a CC but it contains Toluene and MEK!! It is only 35% solids which means you are trying to get rid of 65% solvent. If you must use it due to customers requirement then
Electronics Forum | Mon Dec 28 09:12:56 EST 2009 | kpm135
@tommyg_fla According to the TDS the recommended coating thickness for Humiseal 1B31 is only 1-3 mils so if I had to guess I would say your issue might be that you're re-coating over the first pass too soon. All the solvent hasn't evaporated and the
Electronics Forum | Wed May 28 14:35:47 EDT 2003 | davef
Wow, you're very correct. I guess we use silicone to calibrate our machine, as follows: XPS spectral measurements of dimethyl silicone should include O(2s) at 25 eV, Si(2p) at 102 eV, Si(2s) at 153 eV, C(1s) at 285 eV, and O(1s) at 533 eV. The C(1s
Electronics Forum | Tue May 27 12:40:50 EDT 2003 | davef
Hi Bill You said, "silicon". We assume by your discussion that you ment to say, "silicone". For background on silicone and soldering, check with Dow Corning [517-496-6000]. They make a OS2 [VOC-free] silicone stripper and should be able to give y
Electronics Forum | Tue Apr 09 00:26:46 EDT 2002 | craigj
Are currently investigating a change of solder paste for various reasons and are considering a move from 63/37 to using 2% silver solder paste for increased long term reliabilty of solder joints with gold finish PCBs and to further reduce reflow temp
Electronics Forum | Wed Jan 30 06:45:01 EST 2002 | yaq
Hi, Has anyone done some research (measurement/simulation) on the effect of PWB vias on solder ball temperature of the component? Would this have some effect on solder joint reliability especially during power cycling? Any comments will be appreciat
Electronics Forum | Thu Jan 31 04:48:04 EST 2002 | yaq
Hi, Has anyone done some research (measurement/simulation) on the effect of PWB vias on solder ball temperature of the component? Would this have some effect on solder joint reliability especially during power cycling? Any comments will be appreciat
Electronics Forum | Tue Apr 09 05:36:27 EDT 2002 | lhudson1
Silver in the paste is present to minimise any negative effects of silver in the pcb finish or component terminations. 2% Ag prevent silver leaching thus giving a more reliable joint.
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