Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis
QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in
Electronics Forum | Tue Apr 10 02:57:53 EDT 2018 | rob
Yes I would, most of our old Yamaha machines (before 2005) will do 30-35 microns @ 3 sigma with the fine camera option. Our Jukis with His res camera's will hit it too. You should be OK with most things after 1997 with the right camera choice (whic
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Tue Sep 09 18:07:18 EDT 2003 | davef
We would be very wary of allowing 50 uinches, because this will likely result in reduced shelf life due to intermetallic growth. As a guesstimate, at least 10 uinches of that 50 uinches, and maybe more, is already intermetallic when you receive the b
Electronics Forum | Fri Sep 12 09:10:23 EDT 2003 | Norm Morikawa
Around 1989 I had this probelmm with a SMT CCA that would not solder in one area consistently. I had it cross sectioned by the bare board supplier and found that under their metallurgical microscope the thickness of this HASL bare board could not be
Electronics Forum | Tue Mar 30 10:43:21 EST 2004 | Robert
I could use some help too. I have a bunch of SMD 4 Pads Inductors from Central Technologies. The dimensions of the part is 11.30x13.9x6.9 . I've called four companies already and none were able to find a carrier for this part. These parts are on plas
Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane
i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red
Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied
Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar
Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung
Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass
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