Electronics Forum | Sat Jan 13 17:19:15 EST 2007 | aj
Hi all, What length of time is recommended for the "soak stage"? aj...
Electronics Forum | Sat Jul 03 00:58:57 EDT 2004 | KEN
so what did we do before X-ray? sound process shouldn't need to rely on inspection. Extended soaks can be used to burn off high temp volatiles but I have never heard of 5 minutes! I have used 90-120 sec. to reduce solder splatter....but haven't do
Electronics Forum | Wed Aug 27 14:19:40 EDT 2008 | grics
Have you given this information to your paste manufacturer???(Profile, Pics of defects?) The profile seems to look ok(without knowing paste info...) I think the ramprate looks a little aggressive but it could be the scaling of the profile and the i
Electronics Forum | Tue Aug 18 12:02:59 EDT 1998 | zambri
| Hi, | Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subj
Electronics Forum | Mon Jul 27 21:10:10 EDT 1998 | D.Lange
| Hi, | Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subj
Electronics Forum | Fri May 21 14:22:56 EDT 1999 | Dave F
| Dave, | i tried reflowing bare boards with only solder printed on em and no component placed. we still got voids as same as when components were placed. so atleast one of that theories(voids due to component/component placement)could be considered
Electronics Forum | Mon Feb 24 10:21:29 EST 2003 | ryanm
Just an update on my problem. I spoke to Loctite and they had very few solutions. One thing they suggested to try was to add a thirty-second soak time at 150 degrees to my reflow profile. The problem with that is ramp-soak-spike profiles doesn�t s
Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe
Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s
Electronics Forum | Thu Oct 26 12:40:49 EDT 2000 | NLykus
Antonio, I would need to have more profile information i.e. preheat temp (hold time) as well as soaking zone (time). What is the peak temperature and how long is it held there. Also, one more thing to check, because I have seen it in the past, is
Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber
There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det
