Electronics Forum | Mon Jun 25 10:35:39 EDT 2001 | rkevin
Despite all my efforts I cannot eliminate icycling on my t/h leads. They come and go.... daily, lots of rework. I have eliminated the following from the scenrio: Inadequate flux to promote quick drainage, Pot temperature too low, Soldering surface
Electronics Forum | Fri Apr 06 04:10:25 EDT 2001 | kensmoke
We recently had a multi block panal change at the vendor Now the production lines are producing solderability defects in great number. The makeup of the pcb is a type of fiber glass mask green in color and pads with no tinning just copper lands.
Electronics Forum | Wed Jul 30 16:16:19 EDT 2003 | swagner
What is the industry standard for wave and selective solder PPM defect rate for a world class facility, any responses are appreciated.
Electronics Forum | Thu Dec 05 11:36:30 EST 2002 | William Guatemala
Have you check the flux gravity lately? If not, Check the flux gravity every 6 hours to make sure proper parameters are meet. Here is a list of things that may cause your solder ball problems; Excecive heat, defective fixtures, preheating temperature
Electronics Forum | Thu Aug 15 09:06:59 EDT 2002 | davef
Very short list of strategies: * Accept only products are designed to be manufactured and tested. * Assure components are of the proper form and are solderable. * Make sure your processes are capable and in control. * Provide lots of training for you
Electronics Forum | Wed Mar 12 12:28:52 EDT 2008 | operator
I recently witnessed a process in which the solder pot operator used Techspray WSOL water soluble masking to cover the areas around a connector that was to be soldered on the solder pot. He did not wait for the WSOL to cure. He soldered immediately.
Electronics Forum | Wed Mar 12 16:20:51 EDT 2008 | hussman
Poor training. Don't blame the operator, he was either shown this or left to his own devices. Be the better man and provide him a better process. Regular old peelabale solder mask would be a start.
Electronics Forum | Fri Mar 14 11:18:29 EDT 2008 | operator
The way it works is the liquid solder immediatley cures (or should I say burns) the WSOL where ever it touches it. This hardens and keeps it in place and protects whatever is under it. Some of the WSOL falls of in the pot. I am suprised that the burn
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
