Electronics Forum | Thu Sep 25 17:44:37 EDT 2008 | gregoryyork
strongly agree dont wipe at all, we make an air operated cleaner which blows the powder off while immersed in solvents to break up the flux. cheap and effective as long as you dont wipe first
Electronics Forum | Tue Sep 23 07:27:31 EDT 2008 | realchunks
Do not wipe the board at first before putting it in your cleaner. It will leave more paste in your tank, but you won't smear it into every corner of your solder resist. We found that only our stencil cleaner would clean a board properly and leave n
Electronics Forum | Tue Sep 23 14:13:29 EDT 2008 | slthomas
In piggy back on Chunks' comments, what you might wipe it with can be the problem. Alcohol absorbed by the solder paste inhibits the effectiveness of some cleaning chemistries, and driving it into the nooks and crannies exacerbates the problem. If
Electronics Forum | Fri May 26 21:25:52 EDT 2006 | mika
Yes we do place "big and heavy" SMT DC/DC:s on most of our board's. Please tell us what brand it is or at least what the package look like?!? For instance we place a different numbers of "heavy" DC/DC converters (40x20mm & 45x25mm) that has the pick-
Electronics Forum | Mon May 10 11:24:33 EDT 2004 | Charly
Encounter solder ball crack after reflow, found the solder ball is out of shape after reflow, cross section view found that the solder mask opening is not good ( when we do comparason with diff. supplier substrate.) Does the solder mask shape will af
Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef
First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [
Electronics Forum | Mon Jan 28 16:12:47 EST 2002 | Joe B.
Dave F, thank you for your reply and the references you included. You asked why I'm trying to understand this info, here's an answer: I'm working on an NSF-funded materials-related project, one aspect of which may lead to some advances in the forma
Electronics Forum | Thu Jan 24 19:57:40 EST 2002 | davef
Are there formalized standards for the properties of solder balls? No Get IPC-7095 �Design & Assembly Process Implementation for BGA's�. General comments about array package solder balls are: * Ceramic packages use harder solder, like 90/10. * Pla
Electronics Forum | Thu Jan 24 11:47:15 EST 2002 | Joe B.
Are there any formalized standards for the properties of solder balls? Example properties: sphericity uniformity(variance) of the ball size distribution surface roughness surface oxidation or other surface treatments/contaminants ?? As someone rela
Electronics Forum | Fri May 07 16:28:07 EDT 1999 | Andrew Wulff
On 1.27mm (0.050 inches) Standard Ball Grid Array's. The ball size diameter starts at approximately 0.025 inches. If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? This is a known L
