Electronics Forum | Mon Dec 15 11:28:26 EST 1997 | Mr. Paul R. Graham
I require a Template for an internal Solder Paste Stencil Specification. If any one has ANYTHING, could you please reply. Graham
Electronics Forum | Fri Apr 03 14:42:08 EDT 2009 | rkevin
Looking for potential pastes to evaluate (success stories), and any and all paste evaluation procedures you may have used sucessfully to qualify a new product. Definition, slump, release, tack, voiding, reflow window, etc. Thanks for any and all h
Electronics Forum | Thu Sep 23 01:54:54 EDT 2021 | auriga2001
We use nanocoating also on the stencils we purchase for our facility. It's easier to clean, there is less wear on the surface, and the solder paste releases better from smaller apertures.
Electronics Forum | Tue Feb 08 19:44:31 EST 2005 | Dreamsniper
Is there IPC Standards that I could use with the following evaluation: a) Solder Paste Printing Performance b) Solder Paste Wetability What standards do you use or criteria when you evaluate solder paste with the above performance? thanks and r
Electronics Forum | Wed Dec 31 23:11:07 EST 1997 | Scott McKee
| I require a Template for an internal | Solder Paste Stencil Specification. | If any one has ANYTHING, could you please reply. | Graham My suggestion would be to contact your stencil manufacturers. They've seen it all and know more than most... Ask
Electronics Forum | Tue Jan 06 10:33:50 EST 1998 | Paul R. Graham
| | I require a Template for an internal | | Solder Paste Stencil Specification. | | If any one has ANYTHING, could you please reply. | | Graham | My suggestion would be to contact your stencil manufacturers. | They've seen it all and know more than
Electronics Forum | Thu Jul 09 13:05:46 EDT 1998 | Phil Crane
I am looking for some guidelines on evaluating solder paste. I am specifically interested in No-Clean Pastes, as they are a completely new ball game when it comes to slump, tack time, stencil life, tack time, etc. Thanks for any and all help given
Electronics Forum | Thu Jul 09 13:04:19 EDT 1998 | Phil
I am looking for some guidelines on evaluating solder paste. I am specifically interested in No-Clean Pastes, as they are a completely new ball game when it comes to slump, tack time, stencil life, tack time, etc. Thanks for any and all help given
Electronics Forum | Wed Sep 15 08:14:18 EDT 2004 | Rick J
Hi, I am planning to evaluate and qualify solder paste that we never used before. What are the test data that I need to request from the paste manufacturer for our QA prior to evaluation? And is there anything that you could provide me such as ideas
Electronics Forum | Thu Aug 20 13:59:42 EDT 2009 | dcell_1t
Hi there! After various trial-error experiments we determined that two factors are the most insignificant in order to reduce or make worst the issue, those factors are: Placement force: regular placement vs "force applied" to dip the component on th