Electronics Forum: solder paste issues gold padas (Page 7 of 8)

Re: Pb Free Products

Electronics Forum | Thu Sep 23 10:29:34 EDT 1999 | Dave F

| | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no Sn

Re: Pb Free Products

Electronics Forum | Thu Sep 23 11:35:10 EDT 1999 | Earl Moon

| | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no

Re: Pb Free Products

Electronics Forum | Thu Sep 23 12:30:52 EDT 1999 | Wolfgang Busko

| | | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (n

Re: Pb Free Products

Electronics Forum | Thu Sep 23 12:43:27 EDT 1999 | Earl Moon

| | | | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations

Re: Pb Free Products

Electronics Forum | Sat Sep 25 08:00:11 EDT 1999 | Brian

| | | | | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead termination

Re: Pb Free Products

Electronics Forum | Sat Sep 25 11:05:08 EDT 1999 | Earl Moon

| | | | | | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminati

Re: Oven Temperature for Solder Reflow

Electronics Forum | Sun Aug 08 20:59:55 EDT 1999 | Dreamsniper

| | | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usua

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach

| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and

Flason SMT Products

Electronics Forum | Wed Oct 03 23:59:44 EDT 2018 | gaintstar

Flason SMT problem solving: http://www.flason-smt.com/new/PRINCIPLE-OF-SURFACE-MOUNT-PROCESS-SMT-PROCESS.html http://www.flason-smt.com/new/Printed-Circuit-Board-PCB-Price-Estimator.html http://www.flason-smt.com/new/Printed-Circuit-Board-Solder-res

Re: HASL - again?

Electronics Forum | Fri Jun 18 14:19:29 EDT 1999 | Earl Moon

| | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave re


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