Electronics Forum | Mon Jul 03 05:39:05 EDT 2006 | ronalds
Hi, I am experience problems while testing wave soldering SMT components that are glued on the solderside (lead free). Between de leads of SOx type IC's and SOT's develop a great deal of solder beads. I have been using a RSS temp.profile while spr
Electronics Forum | Thu Aug 04 14:44:59 EDT 2005 | Shean Dalton
Hi Sandy B, You certainly can clean the BGA's using an inline or batch process. The correct method to hold them during this process, is the method that provides the desired outcome. I'm familiar with the desired outcome for cleaning singulated BGA
Electronics Forum | Wed Jan 14 08:28:15 EST 1998 | Allison
Contact your solder paste manufacturer and get the reflow profile recommended for that particular paste. Then, duplicate that reflow profile on your oven. You will need to use thermocouples. You may have to tweak this profile a little. | We use no
Electronics Forum | Thu Jul 20 05:04:30 EDT 2006 | bing007
We had a similar problem with gold contact pads. Cleanliness is paramount. If you are using foil tensioning system, wash the foil in a stencil wash before use as the cardboard cassettes may be contaminated. Be very careful when loading into a frame f
Electronics Forum | Mon Apr 05 08:25:31 EDT 1999 | ADRIANO FERNANDES
| | | I require some feed back from any one who knows about using a voc free flux in a nitrogen wave solder machine soldering both through hle and smt componants. | | | What disadvantages are there when using this flux? | | | Do you have any contact
Electronics Forum | Tue Jul 23 11:06:00 EDT 2019 | majelacquinn
Currently trying to get away from using stencil printing. Looking for information on Micro-Dispensing and dot size using a Vermes MDV-3200A micro jet dispenser. I am using a Indium led free solder that has size 6 balls. With a 100 micron dispense hea
Electronics Forum | Tue Jan 24 15:16:07 EST 2006 | russ
Are you using an Omega (vibrating laminar flow) or other type of hole fill enhancement? If so, turn it down and this will help with the solder balls coming through the board. Otherwise it seems as though the flux is still to wet/liquidous when it
Electronics Forum | Tue Jul 18 10:16:49 EDT 2006 | russ
Clean up!, check all conveyors for paste, the printer, oven. If you are splattering in the oven than you need a better profile or better paste, one of the two, maybe both. Hope was helpful Russ
Electronics Forum | Wed Mar 22 14:46:54 EDT 2017 | solderingpro
Laser Soldering by nature is a very dialed in process. - Requiring specially formulated flux and solder paste applications that will perform while absorbing a massive amount of energy. What I believe "Gary" is attempting to say is: Laser Soldering c
Electronics Forum | Wed Feb 18 12:18:28 EST 2004 | babe
Sometimes this is related to oxidized paste or paste that has sat onthe board too long before reflow. However most likely this is related to your reflow process. either too slow or too fast of a reflow ramp rate. Heating up an assembly too quickly wi
