Electronics Forum | Mon Mar 12 11:27:35 EDT 2007 | coop
I am not using a solder pallet, I don't think the problem is contamination related, because these parts are on some of our other assemblies, and they're being waved with no problems. The problem seems to be mainly on our panelized boards for some rea
Electronics Forum | Mon Sep 19 07:56:19 EDT 2005 | Pop
How we can improved the Solder voids on QFN Packaging. Actually we adjust the time for solking to long . But is not affected. Pls advise. ThANK YOU
Electronics Forum | Sat Apr 15 14:28:26 EDT 2006 | Dan Mendoza
This may sound like advertasing, but I ran a DOE with five solder paste/flux manufacturers and somehow, the voids went away with the AIM solder.
Electronics Forum | Mon Sep 19 09:08:25 EDT 2005 | siverts
Search the SMTnet archives first. Ex. http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=8877&#Message35126
Electronics Forum | Wed Jun 12 14:42:40 EDT 2013 | armandogomez
Hello guys ! I am here again with a problem, right now we have a problem with a new product, the problems are with voids with the PTH we put a receptacle with terminal blades that are 1.3mm width in a pth with a diameter of 1.5mm we use a pallet to
Electronics Forum | Thu Jan 15 09:40:47 EST 2004 | davef
Search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=24429 Do not get your hopes up about finding something to support your "leaching out of silver theory", though. * AgxSn IMC are disbursed ro
Electronics Forum | Thu Jan 15 09:04:36 EST 2004 | rkevin
Does anyone have any information about eliminating voids on BGA using SN62 as opposed to the normal Sn63, something which explains the inter-metallic layers which form during the soldering process and the leaching out of silver ?
Electronics Forum | Thu Jun 10 19:20:59 EDT 2021 | kojotssss
Hi, Too much paste on grounding pad. Looks like also doesnt have path for gases, for void escaping.
Electronics Forum | Mon Aug 09 10:27:14 EDT 1999 | Tim Murphy
Just curious what effect pinholes and solder voids can have on solder joints that have high current passing thru them. Also could moisture from steam sterilization (autoclaving) get inside a said solder joint and then outgas during high current, and/
Electronics Forum | Thu Jan 14 23:49:00 EST 1999 | Wirat Sriamonkitkul
I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? Thank you, Wirat S. / Jan 15
