Electronics Forum | Mon Apr 23 19:12:23 EDT 2001 | relensky
Thanks for the instructions. I was missing the reflow part... Omikron is the method our board house offers. We have been through the plating thickness problem and tin depletion conditions. Beyond those issues, I have been trying a few different n
Electronics Forum | Mon Apr 23 17:30:08 EDT 2001 | davef
Step 1: Print paste on the board, skip placement, reflow the board, check solderability. Step 2: Goto Step 1. White Tin Solderability: The most common reason for solderability issues with the white tin surface coating during multiple thermal excur
Electronics Forum | Tue Feb 14 13:16:49 EST 2006 | Carol Stirling
CRITICAL DILEMA! Has anyone run into the problem described below and if so, what was the fix (besides not dealing with this Supplier)? Also, we do not have component manufacturing process experience. We are purchasing a surge resistor that function
Electronics Forum | Thu Jun 23 23:58:03 EDT 2011 | jamessunderland
Just want to ask. What is the effect of dull gold surface on solderability? When I made a test run with several pieces containing dull gold defect on the pad(of varying levels), I found that components can still stick to the pad with good amount o
Electronics Forum | Wed Sep 22 14:22:54 EDT 2021 | oclsc
Hi Forum. Is there anyone who can tell if an empty PCB with no SMD components mounted and HAL surface will get a less solderability after been running through reflow (convection). Eg. when testing empty PCB with temperture data logger. Regards Ole
Electronics Forum | Mon Mar 21 02:41:29 EDT 2011 | kemasta
Hi It's me again. Our products need to pass a chamber test 45c/36hrs after the PCBA completed batch of functional tests and assemble in to case. We found 1 unit was functioning for 24hours in the chamber, but hang after that. We tried to re-boot the
Electronics Forum | Fri Sep 06 11:16:08 EDT 2002 | dason_c
To check any solder crack, open under the BGA/CCGA. I am using a destruction test to find out is it related to the reflow profile or the Fab issue. 1. Depense the Dye (I use Dykem Steel Red) under the device. 2. Cure the dye 3. Remove the device 4.
Electronics Forum | Fri Jun 24 09:32:53 EDT 2011 | kahrpr
Looking at the appearance of pads and solder joint is pretty subjective. Especially lead free people are all over the map on the physical appearance of pads and joints. The true test is solderabilty testing, weather it’s just looking for good wetti
Electronics Forum | Mon Jun 27 02:55:45 EDT 2011 | jamessunderland
Testing, huh... Appreciate the feedback. Thanks!
Electronics Forum | Thu Aug 29 07:46:39 EDT 2002 | nifhail
Hello Experts We ran into problem today when one of the board that we assembled having problem at Test, BGA failure. The joints looks good but no continuity. When trying to remove the BGA, i found that the pad on the PCB is intact but black in colou
