Electronics Forum | Mon Dec 23 13:18:04 EST 2013 | stustu
I'm fairly new to SMT, but highly experienced in other materials engineering areas. But have found the definitions/specifications for pastes to be both confusing and inadequate. I have often see graphical representations of the "desired" thermal pro
Electronics Forum | Thu Mar 10 15:10:07 EST 2005 | bandjwet
In reviewing the myriad of BGA reliability tech papers there seems to be little commonality in the type of test protocols. There are tests that are industry specific, device vendor specific and customer specific. What guidance in terms of minimum me
Electronics Forum | Mon Aug 13 11:24:57 EDT 2007 | jimmyjames
If you're getting that kind of error it's most likely that your feeder bank hasn't been told that the stick feeders can be placed on the back of the machine, or like they said in earlier posts, the stick feeder size itself may be incorrect in the sof
Electronics Forum | Tue Sep 27 09:43:38 EDT 2011 | dyoungquist
I did not mean to imply building to class III would prevent failures. Since there seemed to be a little confusion about the classes I threw that out to show that class III was a higher standard. I also agree that while re-work can fix a class III d
Electronics Forum | Wed Jan 03 17:37:16 EST 2024 | davef
IPC Releases IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards Changes address advances in rigid printed board fabrication processes Oct 18, 2023 [https://www.ipc.org/news-release/ipc-releases-ipc-6012f-qualification-and
Electronics Forum | Thu Feb 08 12:16:05 EST 2001 | Antonio
I wasn't specific which type. But all this info helps. Thanks a bunch fellas...
Electronics Forum | Tue Jul 31 09:36:42 EDT 2001 | Cherry P.
To expand a little the question above...Can you give us the specific results of your research and development testing?
Electronics Forum | Fri Nov 05 08:17:44 EST 1999 | NickMata
Explain computer "overload". Specific examples would be helpful. Regards Nick
Electronics Forum | Thu Apr 22 08:42:40 EDT 1999 | ADRIANO FERNANDES
I would like to known what�s MESH SIZE mean in the solder paste specification ?
Electronics Forum | Tue Mar 10 09:13:06 EST 1998 | Olivier de Brouwer
Is there any pull test specifications, or other test to verify the adherence of SMT inductors ?
