Electronics Forum: standoffs (Page 7 of 27)

SMT Design: Package distance and stand-off height

Electronics Forum | Fri Nov 14 07:32:24 EST 2008 | davef

Yes, courtyard gives you the space requirement of a component. Sometimes, the working space of a rework tool takes precidence, though.

Adhesive printing parameters

Electronics Forum | Wed Dec 17 11:25:38 EST 2008 | davef

dots of minimal height. So, use a lower viscosity adhesive. * Higher standoff components => larger (and taller) dots. So, use a high viscosity [typically, also high yield point] adhesive.

Adhesive printing parameters

Electronics Forum | Wed Dec 17 13:34:15 EST 2008 | jorge_quijano

Ok, thanks for the info, fortunatelly we already have our Camalot glue dispenser machine In-line with our MPM, for helping whit the high stand-off components.

ceramic cap crack

Electronics Forum | Tue Jul 06 12:06:32 EDT 2010 | baildl632

Is the board a two sided smt board? If so, where are the standoffs (board supports) located during the second side run? The 0805 being thicker than the 0603 may explain why 0805 was cracked less.

X-Ray machines general questions

Electronics Forum | Thu Aug 05 14:58:18 EDT 2010 | mikesewell

Smaller and multi-row QFNs will probably require an oblique view/5-axis xray with resolution of at least 1 micrometer and preferably a nanofocus machine. Given the low standoff and small pad size, verifying wetting can be challenging on interior pad

vertically mounted PTH components

Electronics Forum | Wed Aug 11 14:45:46 EDT 2010 | davef

Yes, it OK to mount axial PTH component as radial PTH, if that's what you're asking. * There are no rules for orientation. Pick something and stick to it. We like to be able to read the component value / orientation from the top towards the board.

PCB Surface Cleaner

Electronics Forum | Mon Oct 31 13:31:19 EDT 2011 | davef

We're not sure what a 'sticky roller' is, but will it: * Remove ionic materials * Leave no residue * Clean the walls of through holes and vias * Clean under low stand-off BGA and LGA

Vertical bend resistors solder fillet

Electronics Forum | Fri Dec 13 10:06:05 EST 2013 | davef

For vertical mounted, axial leaded components; the standoff from the land to the component body should be 0.4mm[0.016in] to 1.5mm[0.059in]. Right?

QFN standoff, industry standard

Electronics Forum | Tue Mar 26 16:36:00 EDT 2019 | charliedci

80% on edge pads and >60% on center pad(s). So with this in mind the component body should stand off a bit.

QFN standoff, industry standard

Electronics Forum | Wed Jul 03 17:23:03 EDT 2019 | davef

Pavel Murtishev: Please click the link under my avatar [to the left of this message] and send me your email address.


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