Electronics Forum | Sat Jun 12 10:46:32 EDT 1999 | Dean
| Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manufac
Electronics Forum | Wed Dec 22 14:21:13 EST 2004 | James Dornan of APE Inc
A little late but if this subject is still of interest the following paper from APE may be of interestwhen considering IR to Air Bath: HOT AIR versus IR and other convection Rework Systems HOT AIR is the most popularly chosen method of rework in th
Electronics Forum | Tue Jan 11 11:14:09 EST 2000 | Wolfgang Busko
What a challenge! I think it all depends on the equipment used. Seems rereflow of BGA isn�t that good (see the advices for wavesoldering BGA populated boards). Although you might check for the tacking force by sending a sample BGA board head over thr
Electronics Forum | Sun Aug 03 09:44:10 EDT 2014 | isd_jwendell
I have 2 experiences with Manncorp machines and support, both were not good. Example: One manual was written in Japanese. I requested an English version, but was told it doesn't exist so too bad. I had to pay a local translator to get what Manncorp
Electronics Forum | Mon May 21 20:55:19 EDT 2001 | dougk
We have both CP 4/2's and 4/3. We're also running Siemens S20's & F4's. The 4/3's vision is more temperamental and slightly harder to program. Machine startup and nozzle centering takes longer, but placement time is slightly better. Honestly, for wha
Electronics Forum | Tue May 08 12:57:30 EDT 2001 | Morris
I've seen these used & they work quite well. The fiberglass scratch brush. http://contacteast.com/product/prodpage.cfm?grp=4F7A9B48-C870-11D4-8A700050DA5FEB55&sid=FC52FB8C-A662-46E4-B3CBDAD625F7B085 You will want to train the operators to use some
Electronics Forum | Wed Aug 01 17:17:15 EDT 2001 | mparker
Since you are restricting the outward flow of injected material to basically mimic the package dimensions that would force you to design some sort of coffer dam beneath the part to contain the injected material. One alternative to your quest could b
Electronics Forum | Thu Jun 06 15:55:28 EDT 2002 | arzu
I agree with the others and experienced the problem myself this week. Solderballs at the side of the chips. I looked at the board and found that the chip is pressing the paste away too much. This in combination with our quite big pads(and stencilaper
Electronics Forum | Tue Jun 04 17:05:52 EDT 2002 | davef
Solder balls floating around on the air currents of a reflow oven. I sincerely doubt it. Could the solder on your gold fingers be from: * Excess placement force during P&P? * Ejactula from solder deposits during rapid preheat ramp rates? * Ejactula
Electronics Forum | Wed Jul 30 21:20:07 EDT 2003 | davef
It's good for Cookson shareholders that something has forced the managers of Cookson to come to their senses, finally. All those aquisitions never made sense to anyone, except the MBAs and lawyers that reaped the fees from all that paper shuffling.
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