Electronics Forum | Thu Nov 04 19:51:28 EST 1999 | John
Thanks folks. The current vendor is doing an alcohol wash, top and bottom, then performing an ionic test on 100 boards. I'm not to confident in the testing because the readings for a "clean" board are 25 ugm/sq in and a "dirty" board are 40 ugm/sq in
Electronics Forum | Fri Jul 28 14:34:13 EDT 2000 | Gary Simbulan
Belive it or not, these boards were run through a Centech batch mode Vapor Phase machine. Single stage top side IR preheat. Vapor temp 218 C. Solder paste is an SN62 RMA.The boards were FR4 8 layer w/ solder mask, fairly conventional as might be e
Electronics Forum | Fri Jul 15 10:04:02 EDT 2005 | stepheniii
It depends on what you want to accomplish. I believe DB Cooper wants a better product with less wasted effort. If so then Russ and DaveF are the ones to listen to. If you want to impress managers, customers, and others, then you are doing it right.
Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis
QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in
Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
Electronics Forum | Wed May 09 12:07:52 EDT 2001 | caldon
My personal favorite is the Siemens F series and the UIC GSM platform. Both Siemens and UIC have awesome resources for csp, flipchip and baredie processing - Siemens= Dan Baldwin from GaTech; UIC = George Westby from UIC labs. My second choice would
Electronics Forum | Wed Aug 13 05:18:40 EDT 2008 | lococost
that's a pretty cool idea, I like some thinking 'outside the box '! 1. I don't think picking it up and placing it will be much of a problem. once the rivet is placed it will be held in place by the paste. However, you would need to make a tray that
Electronics Forum | Thu May 22 14:44:10 EDT 2008 | samir
Does your top-side preheat NEED to be that high, and so high that you are exceeding the flux manufacturers' spec? If so, what is the reason? Top-side wetting? Are you measuring this temperature at the substrate or solder joint?
Electronics Forum | Fri May 15 14:50:40 EDT 2015 | emeto
My top 3 printers: 1.DEK 2.MPM 3.EKRA Top 3 ovens: 1. BTU 2. Vitronics 3. Heller or Electrovert
Electronics Forum | Mon Jun 01 19:04:45 EDT 1998 | Chris
I run about forty different boards ranging from single to double sided & from 0603 to 324 PBGA. 2> The placement rate is around your spec. 3> And depending on the table arrangement you can get up to & above your feeder needs including several soic vi
