Electronics Forum | Fri Jan 03 02:03:58 EST 2020 | sssamw
What's your target for voiding? I cannot see it violate 25% of solder joint area. Process setting and PCB design can impact the voiding, many factors, such as PCB pad, stencil aperture and thickness, re-flow profile, solder paste, etc.
Electronics Forum | Wed Jul 15 03:11:51 EDT 2020 | wellmanrau
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Electronics Forum | Fri Jul 24 02:56:45 EDT 2020 | wellmanrau
wellmanrau@yeah.net Email: wellman@htgdsmt.com">wellman@htgdsmt.com ; wellmanrau@yeah.net">wellmanrau@yeah.net Shenzhen HTGD Intelligent Equipment Co., Ltd. Website: http://www.htgdsmt.com" target="_blank">http://www.htgdsmt.com
Electronics Forum | Fri Jul 24 03:01:47 EDT 2020 | wellmanrau
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Electronics Forum | Tue Aug 04 02:11:40 EDT 2020 | wellmanrau
wellmanrau@yeah.net Email: wellman@htgdsmt.com">wellman@htgdsmt.com ; wellmanrau@yeah.net">wellmanrau@yeah.net Shenzhen HTGD Intelligent Equipment Co., Ltd. Website: http://www.htgdsmt.com" target="_blank">http://www.htgdsmt.com
Electronics Forum | Fri Dec 10 02:42:58 EST 2021 | hello112
SMT stencil standard: measure the four corners and the middle, target value is 26N/CM or more
Electronics Forum | Mon May 15 21:24:12 EDT 2023 | spoiltforchoice
Not that I have encountered, lots of clever dispensers, nothing that is aimed at printing a board aside from the two you mention, and only one of those targets real production.
Electronics Forum | Mon Jul 27 09:14:01 EDT 2020 | wellmanrau
wellmanrau@yeah.net">wellmanrau@yeah.net">wellmanrau@yeah.net&</a>quot;><a class=roll href="mailto:wellmanrau@yeah.net">wellmanrau@yeah.net">wellmanrau@yeah.net">wellmanrau@yeah.net
Electronics Forum | Tue Feb 21 21:17:41 EST 2006 | Cal Kolokoy
M, The paste height is what you establish it as. You're probably using a laser measurement system, and these depend on where your reference datum is. Some will measure from a silkscreen, a trace, or solder mask. These add height, not to mention H
Electronics Forum | Mon Mar 12 08:00:14 EDT 2007 | rgduval
It sounds like you may be thinking of two different test methodologies. What is required? Bare-bard testing, to verify pcb fabrication? Or populated board testing, to verify manufacturing? If it's bare board testing, the fab house should advise a
