Electronics Forum | Sun May 30 08:50:42 EDT 1999 | Dave F
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Fri May 28 16:30:39 EDT 1999 | JohnW
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach
| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and
Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon
| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a
Electronics Forum | Wed May 27 11:19:34 EDT 1998 | Earl Moon
| | | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered
Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Wed Jul 28 17:46:13 EDT 2004 | Steve Stach
Both temperature and humidity can cause solder paste to behave in a way to cause these formations. Temperature can cause slumping, slumping spreads out the paste, upon reflow perimeter paste does not join the bulk, and because of insuffient oxide
Electronics Forum | Wed Dec 09 22:40:48 EST 1998 | phillip fhunter
| Hi, I know for sure that by controlling temp. and humidity | conditions in SMT assy lines room, one gets advantage in | screen printing, adhesive dispensing, and pick&place | machines mainteinance. Does any one have any advice on why | else is a c
Electronics Forum | Sat Feb 14 19:35:51 EST 1998 | C. Lao
Mr Lao We have some specialist knowledge on this subject and offer both equipment and services for these tests. My first recommendation is that take coupons manufactured by your PC Fabricator and then samples at each manufacturing stage: Bare coupon
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