Electronics Forum | Sat Nov 05 07:17:25 EST 2005 | JeffP
That was the case with your oven but it is not so with ours. First, the distance from walls of the inner chamber to the product differs from one oven to another. Second, the dissipation of heat from metal heats up the air in the oven which in turn h
Electronics Forum | Thu Feb 04 10:00:26 EST 1999 | Terry Burnette
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Fri Apr 10 12:23:27 EDT 2015 | utosun
The recommended wash concentration for stencil cleaning with VIGON SC200 is 25% and this should be confirmed using the ZESTRON BA-20 bath analysis kit. Additional cleaning recommendations are: Wash temperature should be approximately 25 degrees C. /
Electronics Forum | Wed Aug 22 17:39:19 EDT 2007 | K
I was wondering if there is anyone out there who is soldering the Luxeon Lumiled LEDs into product. We are working on a product that uses them. They are a challenge in that the are SMT parts, but will not withstand reflow temperatures. The manufact
Electronics Forum | Thu Feb 15 19:41:38 EST 2001 | davef
What do you mean by "But after performing temperature cycle test, the former aging rate (from the shear strength ) seems faster than the latter."? Comments are: I can't recall having heard the term "precipitation hardness" [not that that means anyt
Electronics Forum | Fri Apr 07 11:19:55 EDT 2006 | muse95
Technically speaking, most likely yes it will work, unless possibly it is a BGA. There are issues surrounding BGA's. Here are some of the general issues: On any type of component, if the Pbfree solder you are using contains bismuth, then the Pb in
Electronics Forum | Wed Aug 15 01:30:56 EDT 2007 | wayne_
To be more specific. I am actually talking about the electrical fatigue whereby a unit is undergo a cyclic electric test. Unlike thermal fatigue, it is all talking about temperature related testing, eg, ageing test, thermal cycle test, etc. Anyone of
Electronics Forum | Thu Jun 08 20:07:32 EDT 2023 | daniel_stanphill
The answer to this lies within the datasheets of the components on the board. Each component has its own specs as far as number of heat cycles, time at reflow, peak temperature, whether it can be washed, etc. You do not need to be as thorough on th
Electronics Forum | Fri Jul 04 01:32:15 EDT 2003 | rheise
I've seen numerous incidences of mirror image cracking under endcaps in high dielectric material ceramic capacitors due to thermal cycling. If the cracking is deep enough to extent through the plates you can get breakdown and shorting. Section the ca
Electronics Forum | Fri Dec 17 13:23:15 EST 1999 | Chris
I have an underfill material which takes 6 hours to cure. It works great, better than any other underfill I have ever used. A vertical cure oven is too expensive. I am currently using batch style ovens and opening the oven door as additional produ