Electronics Forum | Thu Sep 03 04:53:31 EDT 2009 | d0min0
to summarize - 3 components are placed on a single module x 8 on pcb - 2 anodes & 1 cathode are infected (so no component for us) - the problem does not look like wetting problem as the component and land pad is wetted, but the paste is not complete
Electronics Forum | Fri Jun 08 12:54:28 EDT 2012 | fredc
The original post was back in 2007. My most recent communication with Peter was last year and he was still having the problem 4 years later. Since it is temperature related, I am suspecting the card in question got partially cooked once and is now al
Electronics Forum | Tue Jun 19 12:15:45 EDT 2001 | Gil Zweig
I have made reference to X-ray Ball Bond Signatures a number of times, and I cannot overstate the importance of quickly qualifying the overall ball bond pattern as either uniform in size and shape or not. Software is available that will make this qua
Electronics Forum | Wed Oct 10 12:20:44 EDT 2007 | slthomas
Does it fail to function or does it function outside of acceptable tolerances? If the latter I wouldn't know what to think, but if the former I would feel obligated to suspect solder quality or maybe even a component problem with the elevated lead-
Electronics Forum | Wed Jan 13 12:33:15 EST 2016 | trampacorp
Baking it's key for success on this task. Water evaporates @ 100 deg. C. Use that temperature, or higher, for that process and your problems or concerns can be taken care of. Be wise on your cleaning process, otherwise this could lead to failures too
Electronics Forum | Wed Sep 05 08:10:45 EDT 2007 | davef
Questions are: * Do not judge the quality of a solder connection by the shineyness or color of the solder connection. Do you have smooth and unform flow, no pitting, and good wetting to the lead and the pad? * What is the temperature of the leads of
Electronics Forum | Tue Jan 20 06:38:06 EST 1998 | Igmar
Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Quad Flat Pack) device in a reflow oven? We recently used a CY7C375i in a TQFP160 package and we experienced warping (bending) of this com
Electronics Forum | Wed Feb 02 21:17:55 EST 2000 | Steve Harshbarger
Istvan, The advise from both Roni and Mike sounds right on the money. The problem is most likely that your PCB is not completely dry (the flux has not completely evaporated) in the area where these solder balls occur. You have a number of differen
Electronics Forum | Mon Sep 13 07:27:50 EDT 2021 | denism
There may also be a problem with the a thermoprofile. Measure the temperature of both contacts of the component, if they heat up not evenly and the soldered lead heats up faster, then the problem is in the profile. To solve the problem of misalignmen
Electronics Forum | Sun Apr 23 09:07:42 EDT 2006 | kanna
i have one problem here with BTU TRS-14. we encounter Over temperature Alarm trigger when run lead free product. our profiling peak temp is 230 degree's and the temperature set point at zone 4 top/bottom is 260 degree's. can any help on this issue
