Electronics Forum: testing for lead coomponents (Page 7 of 8)

The Importance of Predictability for Advanced PCB Manufacturing

Electronics Forum | Tue Mar 02 02:46:36 EST 2021 | Jessie Gao

If there is a way to ensure that the product is reliable, it is to ensure the predictability of its PCB, which is an important part of the product. In fact, PCB is the core component in almost all electronic products (from phones to computer systems)

More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin

| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 23:36:28 EDT 1999 | karlin

| | | Hi, | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | Question: | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Fri Oct 08 02:31:07 EDT 1999 | Brian

| | | | Hi, | | | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | | | Question: | | | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowab

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

How long does it tkae for Tin-Lead solder to rust if put outside

Electronics Forum | Tue Oct 02 15:33:28 EDT 2007 | shrek

So, a test probe from ICT will not make solder rust?

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef

Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ

Re: Where can I purchase a PCB with a bare copper grid for solder flux evaluations.

Electronics Forum | Sat Aug 28 09:23:36 EDT 1999 | Mike McMonagle

| I have looked through the IPC web page and surfed to frustration. Can somebody give me a lead? | Check out the EasyBraid website below, they carry IPC standard coupons, flux test kits and SIR meters at reasonable prices.


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