Electronics Forum | Tue Jan 13 22:43:11 EST 2004 | davef
We have seen this in reflowed parts, where there is flux res collected in the dimple in the solder, where the lead 'presses' in the solder. Generally, we attack this as a thermal issue: * Thermal pads sucking the heat away from the leads. * Leads no
Electronics Forum | Fri Jul 27 09:47:20 EDT 2018 | davef
Adding to Rob's suggestions ... One of the theories about voiding in thermal / ground pads of BTC is: Solder starts melting at the edge of the pad and moves inward towards the center of the solder mass. This traps flux volatilizes. So, there needs t
Electronics Forum | Tue Nov 09 23:32:11 EST 2010 | bising
Stencils are 5mils thickness, SS material. Printer is Accela.
Electronics Forum | Fri Nov 12 13:41:02 EST 2010 | scottp
I wouldn't count on solder bridging that kind of gap. I've never used solder preforms, but I wonder if that would be worthwhile to try?