Industry News | 2020-08-22 04:19:37.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.
Industry News | 2021-05-21 12:12:03.0
Device Reduces Component Temperature by Over 25%, Enabling Higher Power Handling Capability or Longer Useful Life
Industry News | 2022-04-28 14:33:02.0
Indium Corporation® Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., MSc, will share his technical expertise and insight on solder thermal interface material (TIM) processes at Electronic Components and Technology Conference (ECTC) taking place May 31-June 3, in San Diego, Calif., U.S.
Industry News | 2018-06-03 19:11:33.0
SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.
Industry News | 2013-03-12 14:11:50.0
After successfully launching the first X3 In-line X-Ray system in 2011, MatriX Technologies now presented its new X3L system in the USA. As of this year, besides the universal 3D inspection system X3, the X3L configuration is available with an innovative dual detector concept, combining a line-scan for transmission inspection of complete PCBs in a few seconds and a high-resolution digital flatpanel detector for selective 3D image capturing.
Industry News | 2021-08-13 08:33:52.0
Five Indium Corporation experts will participate in the SMTA South China Conference, Aug. 25-27, Shenzhen, China. This event is held in conjunction with NEPCON Asia 2021 at the Shenzhen Convention & Exhibition Center.
Industry News | 2022-01-10 16:39:30.0
Indium Corporation's Ron Lasky, Ph.D., PE, senior technologist, will share his industry knowledge and expertise during two presentations at the SMTA Pan Pacific Microelectronics Symposium (SMTA PanPac), Jan. 31-Feb. 3, Honolulu, O'ahu, Hawaii, U.S.
Industry News | 2011-03-21 13:00:44.0
KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces an opportunity to win an Apple iPad2 by beating its award-winning Auto-Prediction Navigator Profiling Software. All participants will receive a certificate for a free upgrade to Navigator Power, a $975 value*!
Industry News | 2009-11-06 17:20:54.0
Universal Instruments’ Advanced Process Lab hosted the third 2009 Advanced Research in Electronics Assembly (AREA) Consortium meeting at the Treadway Inn in Owego, NY on October 28-29. More than 75 attendees from the 29 member companies participated in the two-day event and a much larger number has signed up for subsequent webcasts of the presentations. Topics ranged from lead-free solder microstructure and reliability to environmental stress screening procedures.
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
