Electronics Forum | Wed Apr 21 11:33:20 EDT 2004 | tigerlordgm
As one of our small batch processes, we place BGAs on PCB without using solder paste. We apply tacky flux to a predetermined height on a pallet, "dip" the BGA into the tacky flux to wet the solder balls to the set height, and then use a BGA rework st
Electronics Forum | Mon Apr 13 12:11:41 EDT 1998 | Justin Medernach
| | | I would like to invite everyone to share/discuss | | information/knowledge/experience they have with | | the req's that are assumed to be valid for the | | temperature/time relation in the process of reflow | | soldering Pin In Paste, Intrusiv
Electronics Forum | Tue Aug 24 11:44:50 EDT 2004 | Dreamsniper
The best is, create 2 different profiles for each PCB type. Then segregate or separate them and do not let them run together in one line. Switch to the proper profile settings each time you change to other PCB type. This is the best. Each PCB materia
Electronics Forum | Fri Apr 10 03:52:13 EDT 1998 | Frank J. de Klein
I would like to invite everyone to share/discuss information/knowledge/experience they have with the req's that are assumed to be valid for the temperature/time relation in the process of reflow soldering Pin In Paste, Intrusive Reflow or whatever yo
Electronics Forum | Sun Apr 12 12:55:11 EDT 1998 | Bob Willis
| I would like to invite everyone to share/discuss | information/knowledge/experience they have with | the req's that are assumed to be valid for the | temperature/time relation in the process of reflow | soldering Pin In Paste, Intrusive Reflow or w
Electronics Forum | Fri Apr 10 10:04:44 EDT 1998 | justin medernach
| I would like to invite everyone to share/discuss | information/knowledge/experience they have with | the req's that are assumed to be valid for the | temperature/time relation in the process of reflow | soldering Pin In Paste, Intrusive Reflow or w
Electronics Forum | Sat Apr 11 14:31:16 EDT 1998 | Gary Simbulan
| | I would like to invite everyone to share/discuss | | information/knowledge/experience they have with | | the req's that are assumed to be valid for the | | temperature/time relation in the process of reflow | | soldering Pin In Paste, Intrusive R
Electronics Forum | Tue Dec 24 11:01:19 EST 2013 | davef
I wouldn't get too tightly wrapped around the axial of paste suppliers recommendations of thermal recipes. Said another way, "Do not count on the solder paste representatives for good technical advice--they are the ones who came up with these "'TIME
Electronics Forum | Mon Dec 23 13:18:04 EST 2013 | stustu
I'm fairly new to SMT, but highly experienced in other materials engineering areas. But have found the definitions/specifications for pastes to be both confusing and inadequate. I have often see graphical representations of the "desired" thermal pro
Electronics Forum | Thu Apr 24 12:18:01 EDT 2014 | cyber_wolf
You must thermally profile your circuit boards with a data-logger and thermocouples. Just putting in oven set points and looking at solder joints is not enough. Reference IPC-7530
