Electronics Forum: thermal relief microwave (Page 7 of 9)

Re: Providing Thermal Relief On Vias

Electronics Forum | Wed Jun 03 21:25:33 EDT 1998 | John Allan

| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op

Chip Components with big ground pads - Unsolder

Electronics Forum | Thu Jan 29 00:10:17 EST 2004 | Vinny

Hi Dave, Thanks for your reply. I have tried getting the design changed from the customer but they cannot provide thermal relief as this changes the RF performance and they cannot afford to do that. As for profile it does reach the reflow tempera

ceramic cap cracking

Electronics Forum | Thu Feb 03 07:39:24 EST 2005 | davef

The component orientation was just for the calculation. It has no affect on what you're seeing. As an alternate explanation, it's possible that difference in temperature is causing the board to flex in the z-direction [as you say, it may not be f

X-ray capabilities needed for Xilinix 1152-ball BGA

Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon

Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal

Yamaha pick and place

Electronics Forum | Tue Apr 10 02:57:53 EDT 2018 | rob

Yes I would, most of our old Yamaha machines (before 2005) will do 30-35 microns @ 3 sigma with the fine camera option. Our Jukis with His res camera's will hit it too. You should be OK with most things after 1997 with the right camera choice (whic

Re: Providing Thermal Relief On Vias

Electronics Forum | Thu Jun 04 12:22:12 EDT 1998 | John Allan

| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo

Wave Soldering Ceramic PCB's

Electronics Forum | Wed Aug 08 21:18:15 EDT 2001 | davef

Get-out the razor blades, bud. You could run that sukka for 6 sec dwell, cook breakfast on it, and you still will not get fill. [Hole file that is, breakfast will go along ways if peckish, though.] You could fire-up the depleted ozone rework gun [

BGA opens

Electronics Forum | Sun Jan 28 13:26:27 EST 2007 | Sweet Old Bob

Okay you CM haters I don't see anything about the design of the board, other than OSP which is strike one. What is the board size? What is the board thickness? Where is the BGA located on the board? What is your ball to pad ratio? What is your aspect

Problem with solder joints in wave solder

Electronics Forum | Tue Jan 21 13:51:19 EST 2014 | rgduval

Armando, Is the problem in the same spot on the board with every run? If so, there might be something about that particular location that is part of the cause (ie. ground or power plane connection). It sounds like you're seeing blow holes, or insu

Re: Soldering on a Ground Plane

Electronics Forum | Fri Feb 11 10:14:54 EST 2000 | C.K.

Dave, to answer your questions, point-by-point: � Just out of curiosity, how are second side, skippy components oriented on the board with respect to the wave? The SMD's are all oriented in the "correct" direction with respect to wave direction(i


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