Electronics Forum: through hole scrape (Page 7 of 140)

Reflow soldering through hole parts

Electronics Forum | Wed Jan 31 11:20:01 EST 2001 | slthomas

Thanks, Pete. In our case I think the device is just too much of a challenge to take on as a first try at the process. The reduction in lead volume from the optimum round lead to the "crescent" shape pretty much sunk us from the get-go. Just could

Re: reflowing through hole components

Electronics Forum | Tue Apr 07 05:46:15 EDT 1998 | bob willis

| we are looking for paste printing specs.& stencils holes shapes to | perform soldering reliability d.o.e. of the a.m. | subject. | looking forward to your info. | tech. dept. /telrad prod. For information on PIHR soldering there is a report, vid

Re: reflowing through hole components

Electronics Forum | Mon Mar 16 09:23:56 EST 1998 | Justin Medernach

| we are looking for paste printing specs.& stencils holes shapes to | perform soldering reliability d.o.e. of the a.m. | subject. | looking forward to your info. | tech. dept. /telrad prod. Call 1 800 4 INDIUM and ask for a sales person. A paper

Reflow soldering through hole parts

Electronics Forum | Mon Jan 29 20:31:44 EST 2001 | davef

It's common. We've talked about it here several times. Hopefully the fine SMTnet Archive that are available are helpful. If there not talk back. Other sites that are sources of information are: * SMT Magazine * Bob Willis * Phil Zarrow * Amp[c

Reflow soldering through hole parts

Electronics Forum | Tue Jan 30 15:21:45 EST 2001 | dason_c

You can also check Alpha Metals web site for some information. http://www.alphametals.com/products/pin-in-pasteprocess.html Rgds. Dason

Reflow of through hole devices

Electronics Forum | Mon Sep 14 09:30:34 EDT 1998 | Clive Heke

Can anyone point me in the right direction for information on this subject, my understanding is that it is a new technique, not in widespread use yet.

Reflow soldering through hole parts

Electronics Forum | Wed Jan 31 01:41:00 EST 2001 | pjc

Steve, I have no influence over conn design. We paste print-reflow solder two types of connectors. One is a 50 pin IDC w/ 0.5mm lead dia @ 2.54mm lead pitch and a chamfered pointed lead tip. The other is 32 pin DIP w/ 0.36mm lead dia @ 2.54mm pitch

Reflow soldering through hole parts

Electronics Forum | Tue Jan 30 12:03:15 EST 2001 | slthomas

Pete, I'm wondering how much optimisation you needed (or were allowed) to do with respect to connector design. The first one we evaluated had a row of leads that I can only describe as "crescent" shaped in cross section. Impossible to get even 50%

Re: Reflow of through hole devices

Electronics Forum | Mon Sep 14 11:02:28 EDT 1998 | Steve Schrader

| Can anyone point me in the right direction for information on this subject, my understanding is that it is a new technique, not in widespread use yet. click on the link to ITM-SMT.com

Re: Reflow of through hole devices

Electronics Forum | Wed Sep 23 15:13:43 EDT 1998 | Dave

| Can anyone point me in the right direction for information on this subject, my understanding is that it is a new technique, not in widespread use yet. We have a dedicated group that has researched pin in paste and has produced a CD-rom. If you wo


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