Electronics Forum | Sun May 19 06:43:37 EDT 2002 | xzinxzin
I using water-soluble solder paste, the solder paste recommended, the peak temperature is 215 deg C, the dwell time above 183 deg C is 60-90 sec. **How I can do, the flux in solder paste is active enough to remove the corrosion on the Cu leads to get
Electronics Forum | Fri Jun 28 03:04:21 EDT 2002 | Dreamsniper
Forgot to include the following: Dwell time is from 55 secs to 68 secs. Indium specs for the paste is maximum peak @ 228'C and 30 to 90 secs dwell time above 183'C. PCB is a 6 layer board with Dimension of 205 x 166 mm but is slightly dense with 11
Electronics Forum | Fri Mar 26 08:49:22 EST 2004 | patrickbruneel
Dear Sir, If you are looking for the best bang for the buck you will have to stop cleaning and use a no-residue paste instead of a no-clean. No-residue chemistry becomes totaly volatile in dwell time above reflow resulting in residue free boards. I
Electronics Forum | Thu Sep 16 01:54:46 EDT 2010 | sachu_70
Hi Gani, Immersion Ag finish has lesser shelf life as it can get more easily oxidized on exposure. However, I see concern in your Reflow profile. A few questions: Have you compared your reflow profile to the solder paste manufacturer's recommended pr
Electronics Forum | Thu Jun 28 09:54:06 EDT 2012 | mosborne1
Dave, They rework fine. All solder joints on the whole board look great especially for lead free sac305. Here are the reflow specs: SAC305 no clean solder paste – Kester EM907 Kic thermal profiling device – 50%process window green light profile. • M
Electronics Forum | Wed Sep 05 14:51:47 EDT 2001 | gdstanton
Well, it appears after running both a bare and populated PWB we were seeing flux exhaustion on the uBGA. The problem apparently resulted by a recent maintenance effort where the air blowers in the reflow oven were replaced. The blower replacement m
Electronics Forum | Tue Dec 07 08:11:04 EST 1999 | Wolfgang Busko
Hi Russ, there�s something I don�t understand about the measures you took. I guess that TAL means time above liquidous and shortening of that time can result in bad dissolution of the protective Au-layer. The necessary time for the Au to mix with you
Electronics Forum | Fri Dec 15 08:44:17 EST 2000 | DaveJ
I need some advise from the reflow experts. In your experience in nitrogen versus air reflow, what would be the differences in profile parameters? For example, if I profiled a board in nitrogen and achieved (for a particular component) ramps rates un
Electronics Forum | Wed Jan 31 17:04:22 EST 2001 | williamh
Hello all, I am having a problem with solder balls on chip resistors and chip capacitors. I have searched the archives and found some information concerning solder balls but have a couple more questions. 1. What is the realistic industry standard f
Electronics Forum | Tue Dec 14 12:00:34 EST 1999 | Kris Wiederhold
We recently reduced our standard aperture reduction to aid in the reduction of solder on gold defects. Since this reduction in aperture size, we have been experiencing exposed copper at the end of the component pads. The heel and toe joints are per
