Electronics Forum | Fri Aug 19 02:16:40 EDT 2011 | ppcbs
In my opinion destructive methods went out with the stone age. At least they did at our company. We specialize in non-destructive defect analysis. We can determine where the failure is i.e. assembly process, fab defect, BGA defect or plating proce
Electronics Forum | Sat Nov 03 11:20:35 EDT 2012 | davef
EricR: There's substantial information about the properties of solder alloys on the web. Here's an example of something that I clipped from one site Alloy ||Solidus (°C)||Liquidus (C°) ||Tensile Strength (psi / MPa) Sn42 Bi58||-E-||138||8000 / 55.2
Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway
Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps
Electronics Forum | Sat Dec 18 14:27:42 EST 1999 | g cronin
clarissa like in the other response if you have good technical support internally you can have good results with used equipment. We have run used chipshooters and pick and place equipment, but if we didn't have qualified personel internally to serv
Electronics Forum | Thu Oct 16 10:17:51 EDT 2008 | kevslatvin
I'd start by looking at the available tips from the manufacturer of the iron you are using. They usually have a selection of specialty tips in their catalog either online or in print.
Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis
Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture
Electronics Forum | Thu Sep 07 15:24:29 EDT 2000 | Murad Kurwa
Steven, Try http://www.document-center.com/home. You will find various standards for BGAs freely-available but not for free. BTW, I have never seen a BGA underfilled. Only FC and CSPs. The standards available will explain when to.....High CTE delta
Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis
Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture
Electronics Forum | Wed Aug 19 05:00:56 EDT 1998 | Tom Blum
Hi there, I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In order to
Electronics Forum | Fri Jan 24 16:57:39 EST 2003 | MA/NY DDave
Hi, I will give just one of the couple of ways I have seen. Once a particular product is debugged, verified through the process the profile of the Oven and it's settings are stored on a separate PC. Prior to running that product and at the start of
