Electronics Forum | Fri Aug 11 22:50:57 EDT 2017 | heros_electronics
Anyone who knows how to prevent such flaw? Tombstones are those lifted components from one sides. This results in costly and time-consuming amounts of touch-up and re-work after the assembly is completed. For the customers, this extra work translate
Electronics Forum | Thu Jan 20 08:08:24 EST 2011 | deanm
Because we build Class 3 assemblies, our company has formal inspection steps on our routes. CCA's go through surface mount and then an operator inspects the solder joints for defects and corrects them (touch-up). Following this they go to formal insp
Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge
I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve
Electronics Forum | Tue Jan 04 08:40:24 EST 2000 | g cronin
don't you just love those design guys sometimes, this is an issue that pops up every once in a while with us too. We have a couple assemblies that have hundreds of vias on pads. We have tried and had some sucess with: increasing squeegee pressure,
Electronics Forum | Tue Oct 26 14:26:28 EDT 1999 | John Thorup
A paint might be pretty but it won't do anything but bad for your fingers. What dave is suggesting that you run a search for is actually a spot re-plating process that you can perform with little mess or fuss. But really, find out why it happened a
Electronics Forum | Mon Feb 15 15:43:06 EST 1999 | Dave Jurena
Hope some of you out there can help me with this one. I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they do
Electronics Forum | Sun Jul 26 20:56:43 EDT 1998 | Masdi Muhammad
We are trying to reduce the number of units fail at system test due to flux on gold finger. We know so far that the flux is deposited onto the goldfinger during touch-up or rework and to reduce the contamination we are planning to implement 'tapin
Electronics Forum | Wed Jun 26 15:34:09 EDT 2002 | Daan Terstegge
It does work, but you must keep in mind that not only the stencil must be designed for it, but also the board. Trying to use the pin-in-paste process for a connector with an ordinary wave-solder layout will result in lots of touch-up. You'll need sma
Electronics Forum | Thu Aug 01 08:58:47 EDT 2002 | Rick Lathrop
Good morning Dave F. I am not going to try to touchup the solder pad until I get surface analysis work done, don't want to ruin the evidence. I am getting XPS work done not XRF, XPS is X-ray Photoelectron Spectroscopy and can see very thin films of o
Electronics Forum | Tue Jun 01 19:42:46 EDT 2004 | Ken
The biggest fear is mixing the solder pastes and bar solder. Had a training program for teaching folks what the alloys are and how to read them. I have locked up the bar solder and use the buddy system to restock the pot. Put up many signs on le
