Electronics Forum | Thu Jun 23 00:28:42 EDT 2005 | KEN
....how does the part perform in a wetting test. Is it solderable on a bench or dip-plating in a pot? If you add flux and heat can you fix your problem assemblies? If yes, plating finish or substrate is not your problem. What flux are you using?
Electronics Forum | Fri Sep 05 04:21:37 EDT 2008 | aj
Hi all, If you are profiling a pcb that has a wide variety of comonpenents with varying temperature sensitivity requirements what do you do? e.g. 1136 ball BGA with min reflow temp 245 with tsop48 with max reflow temp 235 etc. rgd's aj
Electronics Forum | Mon Jan 26 11:18:10 EST 2009 | evtimov
It seems like your parts are acceptable regarding IPC610. I would't bother if all in the specs. But the question is why you damage your partss in P&P process. I think you should avoid that instead of looking for standards. Regards, Emil
Electronics Forum | Fri May 10 05:57:26 EDT 2019 | vinitverma
As long as it is in tape, go ahead and place it. You won't have any problems. I've place TSOPs and QFPs with Sapphire.
Electronics Forum | Thu May 23 10:10:30 EDT 2019 | emeto
Would you consider to glue this part when running first side? The other way is to create a pallet that will provide a heat sink in this area(or may be cover this part with FR4).
Electronics Forum | Sat Jun 01 04:39:14 EDT 2019 | gregoryyork
Consider a lower temp alloy(must contain silver) reflow around 210C for second side or dab a small dot of peelable resist next to component to stop movement
Electronics Forum | Fri Dec 01 00:37:20 EST 2000 | arminski...aka..Dreamsniper
I have a proto-type PCB with a 48-Pin Fine Pitch TSOP (0.5mm pitch) with a dimension of 19mm L x 11.50mm W x 1.10 Thickness. They are at the bottomside of the PCB and I need to wave solder the board. There are 8 of them at the bottom side. Are they o
Electronics Forum | Thu Mar 15 18:27:40 EST 2001 | traviss
Like I said it was only a rumor I heard but intrigued me enough to play around with it one day. The lambda wave worked better than the chip wave did with makes me believe it was the surface tension of the solder not melting the already soldered parts
Electronics Forum | Thu Jun 25 20:26:37 EDT 1998 | Chiakl
| I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everythi
Electronics Forum | Tue Jun 30 11:51:41 EDT 1998 | Michael Fogel
| | I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everyt
