Electronics Forum | Mon Dec 27 05:16:17 EST 2021 | jineshjpr
Hi Stephen, Thanks for your response. Since the OSP Finished PCB to be execute in mass volume, almost 3 to 4 weeks (Vacuum Sealed Pack) takes place prior to assemble. Although we are using SnPb 63-37 Type 4 solder paste for this single sided SMD asse
Electronics Forum | Tue Aug 26 09:30:56 EDT 2003 | Jim Z
Marc, There are many types of nylon used in the connector industry and some are designed to be used in high temperature (225-250C) oven reflow applications. These high temp nylons are usually types 4/6 and 6T. It sounds like you are either using a
Electronics Forum | Thu Feb 04 09:31:21 EST 2010 | llaerum
I was wondering if someone on this forum are in Austin or Dallas. If so could they post the type of SAC305 WS solder they use. I am interested in type 3 and type 4. Due to our current vendors repeatability issues we are trying to find out who the la
Electronics Forum | Wed Sep 18 06:53:05 EDT 2002 | CH
1) For solder short, pls check the paste height. Too much vol will cause short. For 15 mils use 5 mils thickness stencil if possible. Check profile preheat time to prevent hot slumpof the paste. 2) type 4 powder will be better for 15 mils pit
Electronics Forum | Tue Jun 15 12:54:34 EDT 2004 | jsmith01
It seems like the break is happening between the sn and ni. The parts are dull in appearance will not take solder even with an iron after they come off so it leads me to believe that there is only ni left on the part. The parts are liquidous for ab
Electronics Forum | Sat Sep 06 03:48:29 EDT 2008 | rameshr
hai, we r using type 4 solder paste in our pcb assembly process - we are now facing the following problem. 1. two component pads soldering was seemed uncoalesced soldered joint except all the other components. 2. what will be the problem & solution f
Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell
Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems
Electronics Forum | Fri Mar 19 00:19:25 EDT 2010 | stevezeva
I've also heard the problem called "Snot-balls". I have a picture: http://stevezeva.homestead.com/Type_4.JPG In my case, this happened because of a bad batch of powder was used when the solderpaste was made. It's happened to me a couple of times sa
Electronics Forum | Fri Apr 16 17:20:34 EDT 2021 | astarotf
We are currently producing a project that brings a TQFP64. But some boards do not solder the component well with its ideal fillet, some are well soldered when they come out of the reflow oven, but some are not. Can the pins be sulphated? How can we c
Electronics Forum | Mon May 18 13:09:55 EDT 1998 | Edward P. Woldendorp, TwenTech
Wanted: by customer in the Netherlands: + used Zevatech PM575 SMD machine or comparable make and type having .4mm pitch and Vision. Capicity: 4,000 comp/hour will do. If available please give full configuration, age, location, asking price. Thank you
