Electronics Forum | Wed Jan 16 22:57:52 EST 2008 | amarpreet41
Any one got experience on handling solder bridging under one corner of BGA?
Electronics Forum | Thu Sep 22 16:06:07 EDT 2011 | davef
Underfilling BGA is an uncommon practice. We'd start looking to find a consultant recommended by our: * Dispenser company * Underfill supplier
Electronics Forum | Mon Dec 28 11:21:21 EST 1998 | Brad Kendall
| Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be help
Electronics Forum | Mon Aug 13 22:39:36 EDT 2007 | davef
The solder used to attach the BGA ball to the BGA interposer would have a liquidous point dependent on the type of solder used by the device fabricator. If this is a lead free device [altho we don't think so], the solder used by the fabricator would
Electronics Forum | Wed Jan 23 18:15:33 EST 2008 | gsala
Hi, are you dealing with Leaded or Lead Free P-BGA ? soldering by Lead or Lead Free paste ? Any way, some time, bridges can be caused by moisture entrapped in the BGA body. Make sure if is respected the correct MSL's allowed flore exposure time, ot
Electronics Forum | Wed Jun 21 18:51:34 EDT 2000 | John
What is the most likely causes of shorts in the corners of BGA devices?. Is there a method of removing single shorts without removing the device?. John.
Electronics Forum | Fri Jul 10 13:42:55 EDT 1998 | Bob Willis
| I am eager to hear from anyone who has experience with X-RAY inspection equipment (specifically for BGA devices) or can make any recommendations. Any knowledge of second hand equipment for sale would also be valuable. | Regards | Rob
Electronics Forum | Mon Dec 12 08:05:11 EST 2005 | bobpan
Quad Align.....Cyber-optics....no difference...they both work well. Never tried a micro-bga but i know the upward camera does standard bga parts.
Electronics Forum | Fri Feb 09 10:00:12 EST 2007 | patrickbruneel
Interesting BGA saga http://www.emsnow.com/npps/story.cfm?ID=24434 To be continued Patrick
Electronics Forum | Mon Aug 13 08:16:19 EDT 2007 | davef
Your theory is reasonable about a component issue. You need to investigate the solderability of the pads on the BGA interposer.
