Electronics Forum | Fri Sep 03 03:56:41 EDT 1999 | Wolfgang Busko
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef
1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)
Electronics Forum | Tue Jul 05 15:24:16 EDT 2005 | davef
60% assy Hutchison||150||150||Disk drive suspension||Flex only, no assy Parlex||130||75||Automotive||Low assy, increasing Innovex||95||40||Disk drive suspension||High assy in other applications Multtek Flex||64||64||Automotive||Low assy, increasing T
Electronics Forum | Wed Apr 28 18:29:25 EDT 2010 | jlawson
when I profile a customers oven / pcb I always > try a check to see if there is basic oven > temperature variation across its width....I have > to say that in my experience I have never seen > any significant variation on the Heller 1707EXL. > O
Electronics Forum | Thu Feb 10 05:09:32 EST 2000 | Wolfgang Busko
Doug: There�s work to do checking the parts of new jobs from new or old customers with library data already existing. Just taking the packagename as matchcode might not work depending on the machines used and the library entries needed because for ex
Electronics Forum | Tue Oct 31 10:47:56 EST 2000 | FWN
Agreed. However, this is for a research paper that my boss may turn into a presentation designed to be given to accountant types. As such, I'm looking for an average hypothetical example. I know that conditions may vary with circumstances, but I'v
Electronics Forum | Thu Aug 31 05:20:08 EDT 2000 | dougie
Thanks for your help guys. We've V-scored boards in the past and it led to difficulties, as mentioned with the depth of groove etc... Our PCB's vary in shape and size drastically, and I mean drastically. So it looks as if a little more though on wh
Electronics Forum | Wed Feb 21 14:18:37 EST 2001 | jagman
Could anyone please give me some insight on the time/temperature requirements for curing SMT adhesive used for a high temperature (96/4 solder) application in a bake oven, rather than using reflow? I understand that it would probably vary from epoxy
Electronics Forum | Wed Feb 21 16:03:14 EST 2001 | blnorman
You're right, manufacturers time/temps will vary. A single manufacturer will have a host of materials with different cure schedules. We currently use 2 epoxies that cure in 2 - 3 minutes at 150�C. One will also cure in 5 minutes at 125�C. Talk t
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