Electronics Forum | Fri May 17 20:11:32 EDT 2013 | isd_jwendell
I am familiar with TI's documents on QFN mounting. I do not have an X-Ray machine, so I worry about excessive voiding that could happen with using the thermal vias improperly. As a general rule-of-thumb, I print paste with a 25% reduction on the ther
Electronics Forum | Fri May 31 18:00:55 EDT 2013 | hegemon
With regards to first picture.(Large themal vias) I would attempt to measure the area of the ground pad, less the area of the "drain" holes or Thermal Vias. From that result I would reduce the aperture to account for about 50% coverage of that remai
Electronics Forum | Fri Dec 22 16:04:26 EST 2006 | mika
Hi, This Not so easy as one wuold think. Has the thermal pad of yours vias? How many? What's the via's dia? What is the pcb thickness? If the the pcb has a "ground layer" connected (vias) to the pcb thermal pad, it could sometimes be a little bit tri
Electronics Forum | Fri Jan 06 00:03:10 EST 2023 | SMTA-64419298
Hello Evtimov, sorry...just saw post as I was looking through list...a bit late. I don't know if you ever got your answer. IPC-4552A covers EniG finishes and suggested shelf life. I've referred to these doc's quite a bit. Good spec's ! Yes, I beli
Electronics Forum | Wed Oct 03 23:58:23 EDT 2018 | gaintstar
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