Electronics Forum: wave and dpak (Page 7 of 38)

Re: wave soldering surface mount tantalum and ceramic capacitors

Electronics Forum | Tue Feb 16 16:28:30 EST 1999 | Tuffty

| | Can anyone help me with the pros and cons of trying to wave | | solder tantalum and large (1812) ceramic capacitors. I do | | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what

Contamination/process issues of SMT and wave soldered pcb's

Electronics Forum | Thu Jul 03 03:23:04 EDT 2003 | loz

I have been advised recently about pcb manufacturers, that somehow or other supply pcb's with contamination. Visually they are fine, but problems arise during SMT manufacture, ie solder balling, non-wetting on pads, and also during wave solder proces

Contamination/process issues of SMT and wave soldered pcb's

Electronics Forum | Wed Jul 09 19:05:06 EDT 2003 | randywomack

LOZ. Under-cured or out-of-spec(sloppily) applied resist is realistic. What other physics: Shiny resist surface is more prone to balls then matte finish. How about an operator eating fish & chips before handling the boards. Don't laugh... ... saw th

buying guide for used double wave solder and ICT machine

Electronics Forum | Wed Mar 31 21:02:53 EST 2004 | darburch

If you find your self interested in an electrovert machine we have a UP600 for sale, a good machine if you have experience with electrovert. As for a buying guide I'm not sure if there is a reliable source who has compared the different models.

Re: Standard pad sizes for reflow and wave

Electronics Forum | Fri Sep 03 14:37:45 EDT 1999 | JohnW

| | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these siz

Re: Standard pad sizes for reflow and wave

Electronics Forum | Mon Sep 06 19:59:59 EDT 1999 | armin

| | | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these s

Contamination/process issues of SMT and wave soldered pcb's

Electronics Forum | Thu Jul 03 07:53:57 EDT 2003 | davef

That has to be the worst of all worlds. Someone goes out and buys the cheapest parts they can find, gives them to you [Loz], and wants you to assemble a perfect product. Well, it would be nice if you could console yourself by making Derick Jetter m

Contamination/process issues of SMT and wave soldered pcb's

Electronics Forum | Thu Jul 03 18:14:03 EDT 2003 | russ

Kris, I don't know what I HAVEN'T SEEN yet cuz I haven't seen it. (HAHAHA) It is kind of like when you are looking for something and you always say after you found it that it was the last place you looked (Why would anyone keep looking for something

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Thu Jul 15 16:15:13 EDT 1999 | Doug

| Hi, | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | Secondly, I need also f

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Mon Jul 12 21:40:56 EDT 1999 | Earl Moon

| Hi, | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | Secondly, I need also f


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