Electronics Forum | Wed Nov 06 19:03:33 EST 2002 | broncos
If you are certain that reflow process is good, I would suggest starting checking the following: 1. Check to see if leads / pads are contaminated or oxidized. However, this usually results poor solder quality throughout the board. 2. Check the amou
Electronics Forum | Wed Nov 06 16:31:59 EST 2002 | slthomas
I would also consider paste control (don't take it personally...I always have to get after people about this one), time on the stencil, time between print and reflow, solderability of the component leads, paste volume (that one really got us once....
Electronics Forum | Thu Sep 07 07:41:06 EDT 2006 | Bubba
Check for coplaner leads if this just exists at reflow process, i.e. look at part before oven, turn on 3D at placement machine. If you see after wave solder, the wave could cause coplanarity issues on top as well if you are going slow enough to refl
Electronics Forum | Thu Nov 07 09:56:26 EST 2002 | bpan
Thanks for the ideas guys. My QC inspector can take a pick and move the back part of the lead....even though the front of the lead is soldered enough to hold. There is SOME NOT ALL areas where there is no solder on the curved portion of the lead.The
Electronics Forum | Tue Aug 28 16:07:09 EDT 2001 | slthomas
Just talked to my component engineer. We use the B parts also, and apparently the B suffix indicates compatibility with wave or reflow applications, X is for reflow only. Since we only reflow these parts, sounds like that might be the best route fo
Electronics Forum | Mon Feb 23 05:37:23 EST 2009 | emmanueldavid
Necoleta, PWB Blistering/De-lamination may not be due for Titanium finished threads / holders which is typically being used to draw high Shelf Life of Pallets and even flow across Auto Wave Soldering rails. There is also nothing to suspect on Liquid
Electronics Forum | Mon Jul 10 09:25:47 EDT 2006 | nodlac
Here is a nugget from the Data Sheet... Wave Soldering: Excess moisture on the PCB during soldering may lead to random solder balling and poor wetting of some solder joints. IT IS IMPORTANT that the flux solvent carrier (water) is fully evaporated a
Electronics Forum | Fri Aug 25 09:15:43 EDT 2006 | russ
We use a single large pad on board and reduce stencil aperture 50%. If you mask/reduce the thermal pad the solder will not wet out to edges and you will still see the part standoff with the open joints. the purpose of reduction is to wet the paste
Electronics Forum | Mon May 07 11:09:49 EDT 2007 | davef
4 Fluxer Operation 4.1 Set-Up and Check-Out the Fluxer 4.1.1 Spray Fluxer Set-Up and Check-Out 4.1.1.1 Pass a sample unsoldered board through the machine. 4.1.1.2 Remove the board just after passing through the fluxer and the air knife. 4.1.1.3
Electronics Forum | Fri Dec 16 03:47:46 EST 2005 | gpaelmo
Anyone have problems wave soldering white tin finish? We are an ems and our customer provides us the pcb's. SMT and TH components on the board. SMT is fine but when we wave solder, wetting to top side is very poor (solder only flows half way up). We
